Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl&amp;lt;inf&amp;gt;2&amp;lt;/inf&amp;gt;

Sbar, Neil

doi:10.1109/tphp.1976.1135141

Cited by 35 publications

(8 citation statements)

References 6 publications

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“…Since these variables can be precisely controlled without hazardous gases, standard temperature humidity chambers have been developed and THB is the usual type of test performed to certify equipment against corrosion. During the development of THB, Sbar [14] and others noted that the accidental presence of CO 2 and other water-soluble ion-generating species could significantly change the corrosivity observed in THB tests. This could lead to apparent paradoxes in which the THB test showed more corrosivity at lower temperature than at higher temperature, because the corrosion process was dominated by the concentration of ions such as HCO 3 , which left a water film at higher temperatures.…”

Section: Description and Historymentioning

confidence: 99%

“…This could lead to apparent paradoxes in which the THB test showed more corrosivity at lower temperature than at higher temperature, because the corrosion process was dominated by the concentration of ions such as HCO 3 , which left a water film at higher temperatures. Sbar and others performed some of the first BMFG tests and showed the significance of gases such as Cl 2 and SO 2 for some important corrosion processes [14,15]. Work by Naguib and others on THB and related testing of electrochemical migration allowed rough relationships to be established between water droplet tests and THB tests [11].…”

Section: Description and Historymentioning

confidence: 99%

“…Development of silverpalladium alloys highly resistant to electrochemical migration failure convinced some that this failure mode could be conquered. Failure time acceleration models were developed, which are still in use today, to project the time-to-failure (TTF) results of THB tests to real world conditions [14]. MFG testers also developed acceleration models for unbiased corrosion failure modes.…”

Section: Description and Historymentioning

confidence: 99%

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Biased mixed flowing gas testing for world class reliability

Derkits¹,

Franey²,

Reents³

2006

Bell Labs Tech. J.

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Section: Description and Historymentioning

confidence: 99%

Section: Description and Historymentioning

confidence: 99%

Section: Description and Historymentioning

confidence: 99%

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Biased mixed flowing gas testing for world class reliability

Derkits¹,

Franey²,

Reents³

2006

Bell Labs Tech. J.

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“…On one hand, the ECM susceptibility of Au was first detected on the surface finishes of printed circuit boards (PCBs). On the other hand, numerous other investigations have also found ECM processes of gold on ceramic thick film circuits as well as in ceramic packages [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 ]. The reports described that the ionic surface contaminants (mainly halogens such as chloride) can act a significant part in the case of gold ECM, while in chloride ion-free cases, migration was not detected.…”

Section: Introductionmentioning

confidence: 99%

On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?

et al. 2021

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Electrochemical migration (ECM) forming dendritic short circuits is a major reliability limiting factor in microcircuits. Gold, which is a noble metal, has been regarded as a metallization that can withstand corrosion and also ECM, therefore its application in high-reliability metallization and surface finishing systems became widespread although it has a relatively high and fluctuating price. Gold electrochemical short circuits have been found only in the case of halogen (e.g., chloride containing) contaminants that can initiate the anodic dissolution of gold via complex ion formation. The experimental results of the study demonstrate that gold can form dendritic shorts even without the presence of halogen contaminants, therefore the direct anodic dissolution of gold must also be supposed. This could also be a serious reliability influencing factor even when applying gold metallization systems and must be taken into consideration. The theoretical background of the classical (contaminant-free) model of gold is also discussed in the paper.

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“…The first workshop on moisture measurement was sponsored by ARPA/NBS on March 22 to 23,1978 (see NBS Special Publication 400-69, Semiaonduotov Measurement Teohnology: ARPA/NBS Workshop V, Moisture Measurement Technology for Hermetic Semiconductor Devices, May 1981).…”

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confidence: 99%

NBSRADC workshop moisture measurement technology for hermetic semiconductor devices II

Cohen¹,

Ruthberg²

1982

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(NBS); it was another in a series dedicated to the furtherance of the measurement technology needed by the semiconductor device industry in its attempt to provide to its customers products that are based on the most advanced technology, yet have high reliability and the affordable costs which result from high yields.It was held at the Gai thersburg, Maryland, facility of the National Bureau of Standards on November 5 to 7, 1980, under the cosponsorship of the National Bureau of Standards and the Rome Air Development Center (RADC). Representatives from industrial, governmental, and academic organizations concerned with device manufacture, analysis, and instrument design participated.The workshop provided a forum for reporting the progress that has been made since the previous workshop of March 22 to 23, 1978, in the measurement of moisture in hermetic semiconductor devices, in the correlation between measurements made by different procedures, in test environments, and in-process control.Thirty-six formal talks as well as numerous question and answer sessions were included.The 99 attendees represented a broad spectrum of the semiconductor and related communities concerned with moisture measurement and control.The workshop was hosted by S. Ruthberg of NBS; R. W. Thomas of RADC was chairman; E. C. Cohen of NBS coordinated workshop arrangements; E. J. Walters of NBS provided editorial assistance and supervised processing; and J, S. Halapatz of NBS provided typing and rework.It is hoped that this report will convey the spirit of the workshop to those who could not attend. DisclaimersThe views and conclusions expressed are those of the authors and do not necessarily represent the official policies of the Department of Defense, Department of Commerce, or the United States Government.Certain commercial equipment, instruments, or materials are identified in this report in order to adequately specify the experimental procedure.In no case does such identification imply recommendation or endorsement by the National Bureau of Standards, nor does it imply that the material or equipment identified is necessarily the best available for the purpose.Papers in this volume, except those by National Bureau of Standards authors, have not been edited or altered by the National Bureau of Standards. Non-NBS authors are solely responsible for the content and quality of their submissions. The workshop, one of a series concerned with measurement problems in integrated circuit processing and assembly, served as a forum to examine the progress that has been made in the measurement and control of moisture in hermetically packaged semiconductor devices. While moisture-induced failure modes and mechanisms have been extensively documented, the lack of accurate and reliable measurement of the moisture content itself has been a major obstacle to meaningful efforts to limit and control this pervasive contaminant. Manuscripts are provided of 36 presentations which detail the progress that has been made in mass spectrometer measurements and calibrati...

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Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl<inf>2</inf>

Cited by 35 publications

References 6 publications

Biased mixed flowing gas testing for world class reliability

Biased mixed flowing gas testing for world class reliability

On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?

NBSRADC workshop moisture measurement technology for hermetic semiconductor devices II

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