Bending-Peeling Method to Research the Effect of Lateral Stress on Superconductivity of REBCO Tape at Liquid-Nitrogen Temperature

Xie, Hongfu; Jin, Peng; Shen, Liuyang; Cheng, Junsheng; Zhang, Xingyi; Wang, Qiuliang; Li, Xide

doi:10.1109/tasc.2019.2891176

Cited by 5 publications

(2 citation statements)

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“…For the case of anvil width of 3 mm (figure 4(b)), in addition to stress concentrations and plastic yielding near the anvil edge, locally large relative displacements at the interface between REBCO and Buffer layers can be observed, which can induce interfacial failure near the anvil edge before the other parts of the interface, resulting in smaller interfacial strength test results. For the case of anvil width of 0.2 mm (figure 4(c)), due to the small size of the anvil, the elastic-plastic deformation close to the anvil attachment contributes significantly to the resistance to external loads, which can be expressed by equation (21) [13],…”

Section: Effects Of Anvil Test Conditionsmentioning

confidence: 99%

“…The weak interfacial properties pose a significant obstacle, impeding the progress and practical implementation in high-field scenarios [13,14]. Since excessive radial stresses in superconducting coil structures are the main source of delamination failure in superconducting tapes, transverse tensile strength testing has been widely adopted, including anvil tension [15][16][17][18], pin-pull test [19], bending-peel method [20,21], sample-fixture integration method [22]. Among the various test methods, the anvil tensile test is the most extensively employed by many research groups, such as Van Der Laan et al [15], Shin and Gorospe [16], Zhang et al [17] and Dai et al [18].…”

Section: Introductionmentioning

confidence: 99%

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Error analysis for determining transverse tensile delamination strength of REBCO coated conductors by anvil test: numerical simulation demonstrations

Gao,

Zhang,

Lin

et al. 2024

Supercond. Sci. Technol.

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RE-Ba-Cu-O (REBCO, where RE = Y, Gd, Sm, and other rare earth elements) coated conductor (CC) tapes exhibit considerable potential for application within the domains of high-energy physics and high-field science. Nevertheless, weak interfacial properties pose a significant obstacle, impeding the progress and practical implementation in high-field scenarios. The anvil tension method has been extensively employed for the assessment of transverse delamination strength of REBCO CC tapes. However, the outcomes derived from anvil tension exhibit severe dispersion, thereby impeding its efficacy in evaluating material performance. The underlying cause of this phenomenon remains unidentified. In this study, error analysis of anvil measurement method in determining the transverse tensile delamination strength (TTDS) of REBCO CC tapes was conducted based on finite element (FE) numerical simulations. A two-dimensional multilayer elastic-plastic delamination FE model with main layers of REBCO CC tapes, solder connecting layers and anvil materials were developed based on the bilinear cohesive zone model. The effects of anvil test conditions and the structural configuration of the conductor itself on the test results were discussed. Simulation results show that localized premature cracking of the interface due to stress concentration and plastic yielding of the CC tape around the loading boundary is the root reason for the discrepancy between the anvil test results and the true interfacial strength. Therefore, anvil test conditions (including top anvil dimensions, soldering conditions, loading eccentricity angle, and anvil material properties) as well as the structural configuration of the conductor itself (including edge initial crack length, edge encapsulation width, and stabilizer thickness) have a significant impact on anvil test-based TTDS results.

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Section: Effects Of Anvil Test Conditionsmentioning

confidence: 99%