Bending and Twisting of Internally Pressurized Thin-Walled Cylinder With Creep

Lau, Joseph; Listvinsky, G.

doi:10.1115/1.3157640

Cited by 5 publications

(1 citation statement)

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“…Creep theory provides a mathematical model for the behaviour of rate sensitive elastoplastic materials operating at elevated temperature. Creep strain may be broadly defined as elastoplastic time-dependent deformation under constant load at``high'' temperature (Lau and Listvinsky, 1981). Since different materials have different melting temperatures, it is convenient to define a homologous temperature (the ratio of the test or use temperature to the melting temperature on an absolute temperature scale).…”

Section: Introductionmentioning

confidence: 99%

Bending and twisting of cylindrical solder interconnections with creep

Lau

2001

Soldering & Surface Mount Tech

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An exact analysis is presented of the creep deformation of cylindrical solder interconnects subjected to the actions of bending moments, twisting moments, and axial forces. Dimensionless interaction curves and charts are also provided for engineering practice convenience. These charts show the interactions of the relevant variables, i.e. interconnect geometry; solder material properties; axial force; bending moment; twisting moment; bending stress; shearing stress; curvature rate; and twist rate. In the results presented the Garofalo‐Arrhenius steady‐state creep equation is used to provide the constitutive relationship for SnPb36Ag2 solder interconnects.

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Section: Introductionmentioning

confidence: 99%