Bended Differential Transmission Line Using Compensation Inductance for Common-Mode Noise Suppression

Chang, Chia-Han; Fang, Ruei-Ying; Wang, Chun-Long

doi:10.1109/tcpmt.2012.2192439

Cited by 59 publications

(29 citation statements)

References 11 publications

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“…그림 20은 두 신호선의 길이 차이를 보상해 주기 위한 인덕턴스 보상 방법 [42] 과 커패시턴스 보상 방법 [43] 을 보여 주고 있다. 이와 같은 연구는 밴딩 각도에 따른 LC 값을 분석하고 대칭을 이루기 위해 인덕턴스나 커패시턴스 성 분을 인위적으로 하나의 신호 선에만 추가하여 대칭성을 향상시키고, 모드 변환(S cd21 )과 공통모드 전압 저감을 확 인함으로써 제안한 방법을 검증하였다.…”

Section: 선 주변의 비대칭 구조들(Guardunclassified

“…밴딩 부분에 tapered 구조를 적용하 여 차동 신호선의 비대칭 문제를 해결하려 하였고 [44] , 최 근에는 그림 21과 같은 트위스트 구조의 차동 신호선이 제안되었다 [45] . [42] (a) Capacitor compensation method [42] (b) 인덕턴스 보상 방법 [43] (b) Inductance compensation method [43] 그림 20. 차동 신호선의 대칭성 향상 방법 [45] .…”

Section: 선 주변의 비대칭 구조들(Guardunclassified

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Recent Trends in System-Level EMC Investigation and Countermeasure Technology for RF Interference Due to High-Speed Digital System Noise

구태완¹,

이호성²,

Yook³

2014

The Journal of Korean Institute of Electromagnetic Engineering

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This paper presents recent trends in system-level EMC investigation and countermeasure technology for radio frequency interference (RFI) influenced by noise generated in high-speed digital system. Recently, as the only digital device can perform various roles, there are a variety of EMI/EMC problems between systems. Especially, RFI is now recognized as a major problem, which occurs by EMI caused by the digital system. Therefore, in this paper, recent trends of RFI investigation from component-level to system-level are introduced and analyzed. Furthermore, in order to solve the RFI problem, recent researches are presented and investigated for the occurrences and suppression methods of common-mode noise which is one of the major noise sources in high-speed digital system. Lastly, this paper suggested future research of system-level EMC analysis and countermeasure technology for RFI problems.

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Section: 선 주변의 비대칭 구조들(Guardunclassified

Recent Trends in System-Level EMC Investigation and Countermeasure Technology for RF Interference Due to High-Speed Digital System Noise

구태완¹,

이호성²,

Yook³

2014

The Journal of Korean Institute of Electromagnetic Engineering

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“…An example of common mode compensation structures is bended differential lines using compensation capacitors [1] and/or inductors [2] so as to improve the symmetry of the differential pairs. The third class of filters is discrete component such as common mode chokes.…”

Section: Introductionmentioning

confidence: 99%

PCB structures for common mode suppression on differential microstrip lines

Liu

Pommerenke

2014

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)

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Common mode noise on differential microstrip lines can be suppressed by PCB embedded filters. These filters are basically resonators, and only the common mode signal can couple to them. Though such structure suppress common mode signal only in narrow bands because of the resonant nature, they can be combined to produce broadband filtering effect. The dimension of such filters could be further reduced by adding lumped elements. In this paper, design principles of the PCB filters are given, and examples are given to demonstrate these rules. At last, a new PCB filter structure is proposed with an electrical size of only 0.04λ×0.067λ which is capable of suppressing the higher order harmonics of common mode signal.

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“…[2][3][4][5][6][7][8][9][10][11] The taper bend discontinuities and meander delay line as equi-distance routing technique have been proposed to improve and compensate SI performance. But the papers have mainly focused on SI issue.…”

Section: Introductionmentioning

confidence: 99%

Locally Shielded Differential-Paired Lines with Bend Discontinuities for SI and EMI Performances

Kayano

Ohkoshi

Watabe

et al. 2014

Transactions of The Japan Institute of Electronics Packaging

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To provide the basic considerations for EM radiation from practical asymmetrical differential-paired lines with bend routing, this paper newly attempts to propose locally shielded differential-paired lines for establishing SI performance and suppressing imbalance component and EMI generated by differential-paired lines with bend (called as turnoff point) discontinuities. The conductive plane is placed on discontinuity region asymmetrically. The concept of locally shielded layout is based on compensation of phase-difference due to the bend discontinuities, by using electric-coupling between signal trace and a conductive plane for the shield. The proposed method is suitable for implementing on PCB, without changing layout of the differential-paired lines. To compare the effect of the locally shielded paired-lines on CM component, the |S cd21 |, which is defined as the conversion from DM to CM, are evaluated. The significant suppression effectiveness of |S cd21 | in the case study is achieved below 1 GHz by locally shielded differential-paired lines. Consequently, the validity of the proposed locally shielded layout is demonstrated. It is demonstrated that the proposed locally shielded layout is suitable for improving the SI performance and suppressing the CM in the case study. This study has successfully reported the basic method for suppressing imbalance component of differential-paired lines with bend discontinuities.

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Bended Differential Transmission Line Using Compensation Inductance for Common-Mode Noise Suppression

Cited by 59 publications

References 11 publications

Recent Trends in System-Level EMC Investigation and Countermeasure Technology for RF Interference Due to High-Speed Digital System Noise

Recent Trends in System-Level EMC Investigation and Countermeasure Technology for RF Interference Due to High-Speed Digital System Noise

PCB structures for common mode suppression on differential microstrip lines

Locally Shielded Differential-Paired Lines with Bend Discontinuities for SI and EMI Performances

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