2020
DOI: 10.1109/jmems.2020.2972729
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Bendable Piezoelectric Micromachined Ultrasound Transducer (PMUT) Arrays Based on Silicon-On-Insulator (SOI) Technology

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Cited by 14 publications
(5 citation statements)
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“…In [48], fabrication of flexible PMUTs using flexMEMS technology is described, where the PMUTs were developed on flexible polyimide substrates instead of the conventional rigid silicon substrate. In [49], the bendable structure is made out of several silicon islands containing a PMUT PZT array and are connected to each other by silicon springs, resulting in a fully conformal silicon based structure without the necessity of thinning down the wafer.…”
Section: A Pmutmentioning
confidence: 99%
“…In [48], fabrication of flexible PMUTs using flexMEMS technology is described, where the PMUTs were developed on flexible polyimide substrates instead of the conventional rigid silicon substrate. In [49], the bendable structure is made out of several silicon islands containing a PMUT PZT array and are connected to each other by silicon springs, resulting in a fully conformal silicon based structure without the necessity of thinning down the wafer.…”
Section: A Pmutmentioning
confidence: 99%
“…Since the transducer structure does not require the support layer, expensive SOI silicon wafers are also not needed in fabrication. In addition, no additional SiO 2 18 or AlN 19 film is needed as the support layer, simplifying the laminated structure and reducing the fabrication complexity.
Fig.
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Section: Design and Fabricationmentioning
confidence: 99%
“…making stretchable interconnects for rigid chips, piezoelectric thin-film transfer to flexible substrates, and direct synthesis of piezoelectric material (including flexible piezoelectric materials like PVDF) on flexible substrates with lowtemperature processes. As shown in figure 13(a), a fabrication method is presented to achieve a bendable pMUT array by making stretchable interconnects [272]. The bendable structure consists of several rigid chip islands (each with a 3 × 3 pMUT array) connected together with silicon springs, which are fabricated using the deep reactive ion etching process.…”
Section: Development and Application Trends Of Piezoelectric Mems In ...mentioning
confidence: 99%