Bend strain and tensile stress characteristics of (Bi, Pb)-2223/Ag-Cu alloy sheathed tapes

Abstract

The dependence of Ic on the bend strain and tensile stress characteristics of (Bi, Pb)-2223/Ag-Cu alloy sheathed tapes with varying Cu composition in the sheath has been studied in both mono- and multifilamentary configurations. The irreversible stain (εr) and the critical stress (σc) were found to improve as the level of Cu doping in the sheath increases. εr and σc were found to be about twice as large for the 9 at% Cu doped sample in both mono- and multifilamentary cases compared to the corresponding pure samples. The multifilamentary tapes were found to endure more strains and stresses due to their fine filament structure and low fill factor of the superconductor core. The degradation of Ic above σc was found to be rapid, while that for strains above εr was gradual, retaining a significant amount of Ic even after high values of applied strain.

Analysis of the distribution of critical current of bent Bi2223 composite tape based on a unifying parameter approach

“…As y sc,max /(t/2) in model R is 0.679 for a VAM1 sample, the I c /I c0 can be calculated as a function of relative damage front location, y f /(t/2), as shown in figure 8. The y f /(t/2) is dependent on ε f − ε r and ε B (equation (10)). Combining equation (10) with equation 14, we have…”

Damage evolution under bending and tensile stress and its influence on critical current of Bi2223/Ag superconducting composite tape

“…The tensile fracture strain of the Bi2223 filaments has been reported to be around 0.1% [2][3][4], being several to ten times lower than that of other superconducting filaments such as Nb 3 Sn (0.5-1.2%) [5,6] and Nb 3 Al (0.6-1.0%) for fusion uses [7]. Thus, under the applied strain, the critical current of Bi2223 composite is reduced severely [1][2][3][8][9][10][11][12][13][14][15][16].…”

“…The strain-dependence of critical current is dependent on the fabrication process and structure of the composite such as size and volume fraction of the constituents (Bi2223, silver and silver alloy sheath), as known from the comparison of the reported results [1][2][3][8][9][10][11][12][13][14][15][16]. Taking the case of the bending effect, the reduction in critical current with increasing strain has been attributed mostly to the damage in the tensile side.…”

Software for Invetigation of Current Transport Processes in Semiconductor Structures

“…³äêðèòòÿ âèñîêîòåìïåðàòóðíèõ íàäïðî-â³äíèê³â ³ ïðîãðåñ òåõíîëîã³é âèãîòîâëåííÿ êð³îåëåêòðîííèõ ì³êðîñòðóêòóð ïðèâåëî äî ïðàêòè÷íîãî âèêîðèñòàííÿ ñòâîðåíèõ íà îñ-íîâ³ åôåêò³â Äaeîçåôñîíà êâàíòîâèõ åëåêòðî-ííèõ êîì³ðîê ïàì'ÿò³ [1][2][3][4]. Ïåðñïåêòèâí³ñòü ¿õ çàñòîñóâàííÿ â êîìï'þòåðí³é òåõí³ö³ âè-çíà÷àºòüñÿ âèñîêîþ øâèäêî䳺þ ïîð³âíÿíî ³ç òðàäèö³éíèìè íàï³âïðîâ³äíèêîâèìè åëåìåí-òàìè.…”