Electrically conductive materials capable of bending and stretching are useful for a wide range of applications such as smart clothing, [1] flexible displays, [2] stretchable circuits, [3] strain gauges, [4] implants , [5] high-deformation microelectromechanical systems (MEMS), [4] and dielectric elastomer actuators (DEAs), [6] to name a few. The necessary strain varies from minimal (< 5 %) for applications such as retinal prostheses that only require conformal contact to a surface [5] to high (> 60 %) for large-strain DEAs.[7]A number of approaches have previously been used to produce stretchable electrodes. [8] Printing with carbon grease [6,9,10] or graphite powder [11,12] has been the preferred method for use with DEAs because of the low modulus of these materials, which allows large strains, but they have a relatively low conductivity and can readily be rubbed off the surface. Thin metal films deposited on elastomeric substrates, [13] such as by thermal evaporation or sputtering, can be stretched 10-20 % before failure, [14] or higher if the metal is patterned. [15] In special cases when it is possible to stretch the elastomer during deposition, so that the metal forms corrugations upon polymer relaxation, the achievable strains can be increased even further. [14,[16][17][18][19] Loading an elastomeric host polymer with a conducting material allows some degree of elasticity, but the modulus of the composite increases dramatically with loading, often before the electrical percolation threshold is reached. [20,21] Electrostatic layer-by-layer assembly has been successful in achieving highly conducting, robust, free-standing sheets capable of large strain. [22] Integrating these electrodes with other devices, however, which would include patterning the electrodes, has not yet been demonstrated. Another promising method for producing compliant electrodes is metal ion implantation, [23] which has been used in the fabrication of miniature DEAs. The advantages include patternability and an expectation of a low modulus, while the drawbacks are a rather high sheet resistance (∼ 100 kX/ square), a limited substrate size, a requirement for a low-energy ion implanter, and post-implantation bonding of the elastomer to the Si wafer. The goal of the present work was therefore to develop a new approach to achieving robust and truly elastomeric conductors that can be patterned with standard microfabrication techniques. This communication presents a method for making compliant electrodes that results in materials with a sheet resistance (R s is related to electrical conductivity r through r = 1/R s t, where t is the film thickness, so this corresponds to a conductivity of 50 S cm -1 for our 0.01 cm thick films. R s of only 2 X/& when unstretched that do not lose conductivity until they are elongated by up to 150 %. The electrodes have a Young's modulus of under 10 MPa, and they survive thousands of strain cycles. The electrodes are also photopatternable ( Fig. 1), making them compatible with microfabrication of electronic dev...