“…Due to the potential application based on the highthermal conductivity and low coefficients of thermal expansion (CTEs), tungsten (W) is increasingly considered as a promising plasma-facing material (PFM) for use in modern tokamak facilities with medium to high heat flux components (e.g., EAST and ASDEX). However, using W as a PEM has some shortcomings: brittle at room temperature, high ductile to brittle transition temperature (DBTT) because of the body-centeredcubic (bcc) lattice, heavy weight, and poor workability, as well as poor thermal conductivity [1,2] . One of the solutions to these troubles is to coat W on the copper (Cu) body or its alloy surface, which possesses an excellent thermal conductivity, superb ductility and regeneratibility.…”