1985
DOI: 10.1109/jssc.1985.1052402
|View full text |Cite
|
Sign up to set email alerts
|

Behavior of analog MOS integrated circuits at high temperatures

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

1989
1989
2020
2020

Publication Types

Select...
4
2

Relationship

0
6

Authors

Journals

citations
Cited by 13 publications
(2 citation statements)
references
References 10 publications
0
2
0
Order By: Relevance
“…These include decreased carrier mobility, decreased threshold voltage and exponentially increasing junction-to-substrate (reverse-biased diode) leakage current [4], [18], [19].…”
Section: Cmos Circuit Design At High Temperaturementioning
confidence: 99%
See 1 more Smart Citation
“…These include decreased carrier mobility, decreased threshold voltage and exponentially increasing junction-to-substrate (reverse-biased diode) leakage current [4], [18], [19].…”
Section: Cmos Circuit Design At High Temperaturementioning
confidence: 99%
“…In the absence of good high-temperature simulator models, it is possible to use simple hand calculations to determine the expected variation in analog parameters [19], [22]. For architectures which are generally robust to gross impairments (such as loss of amplifier open-loop gain), this provides an alternative design flow.…”
Section: Cmos Circuit Design At High Temperaturementioning
confidence: 99%