Beamforming with small diameter microphone array

Andráš, Imrich; Dolinský, Pavol; Michaeli, L.; Šaliga, Ján

doi:10.1109/radioelek.2018.8376368

Cited by 3 publications

(1 citation statement)

References 13 publications

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“…For example, the wind through sound port brings pressure fluctuation on the MEMS diaphragm and further degrades the accuracy of voice recognition. Noise suppression and beamforming algorithms [13][14][15][16] are generally applied in communication devices with acoustic microphones to improve call quality. However, it remains challenging to improve the voice signal in extremely noisy environment with poor signal-to-noise ratio.…”

Section: Introductionmentioning

confidence: 99%

Design and implementation of dual pressure variation chambers for bone conduction microphone

You¹,

Lo²,

Chan³

et al. 2020

J. Micromech. Microeng.

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This study presents a bone conduction microphone (BCM) to detect the variation of air pressure resulted from the skull vibration. The presented BCM consists of a commercial MEMS microphone, the sensing circuits, the bulk metal, the deformable polymer diaphragm, and two printed circuit board (PCB) covers. In this design, two chambers and a vibrating spring-mass structure are hermetic sealed by two PCB covers. As the spring-mass structure vibrates, the pressure of one chamber will increase and that of another will decrease. Thus, the vibration could introduce a higher pressure load as well as a larger sensing signal for the BCM. In application, the device with the dimensions of 3.5 × 2.65 × 1.48 mm3 is implemented. Measurements show the device has a sensitivity of −38.8 dBV, THD < 0.48% at 1 kHz with 1 g excitation, and ±5 dB bandwidth for 100 Hz∼6.7 kHz. Frequency responses of different samples show good repeatability. Furthermore, air leakage effect and crosstalk of the skull vibration sensing module have also been investigated in this paper. The results demonstrate the feasibility of the presented BCM.

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Section: Introductionmentioning

confidence: 99%

Design and implementation of dual pressure variation chambers for bone conduction microphone

You¹,

Lo²,

Chan³

et al. 2020

J. Micromech. Microeng.

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An Innovative Architecture of Full-Digital Microphone Arrays Over A²B Network for Consumer Electronics

Pinardi

Rocchi

Toscani

et al. 2022

IEEE Trans. Consumer Electron.

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Microphone arrays of various sizes and shapes are currently employed in consumer electronics devices such as speakerphones, smart TVs, smartphones, and headphones. In this paper, a full-digital, planar microphone array is presented. It makes use of digital Micro Electro-Mechanical Systems (MEMS) microphones, connected through the Automotive Audio Bus (A 2 B). A clock propagation model for A 2 B networks, developed in a previous work, was employed to estimate the effects of jitter and delay on microphone arrays. It will be shown that A 2 B allows for a robust data transmission, while ensuring deterministic latency and channels synchronization, thus overcoming the signal integrity issues which usually affect MEMS capsules. The microphone positioning is also discussed since it greatly affects the spatial accuracy of beamforming. Numerical simulations were performed on four regular geometries to identify the optimal layout in terms of number of capsules and beamforming directivity. An A 2 B planar array with equilateral triangle geometry and four microphones, three in the vertices and one in the center, was built. Experimental measurements were performed, obtaining an excellent matching with numerical simulations. Finally, the concept of an array of arrays (meta-array) is presented, designed by combining several triangular units and analyzed through numerical simulations.Index Terms-Automotive Audio Bus (A 2 B), automotive applications, beamforming, consumer products, digital MEMS microphones, meta-arrays, microphone arrays, planar arrays, spatial audio, triangular arrays.

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Full-Digital Microphone Meta-Arrays for Consumer Electronics

Pinardi

Toscani

Binelli

et al. 2023

IEEE Trans. Consumer Electron.

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Microphone arrays of various sizes and shapes are widely employed in consumer electronics devices such as smart speakers, speakerphones, smart TVs, smartphones, PCs, and headphones. Therefore, the possibility of creating arrays of arrays (i.e., meta-arrays), by easily connecting several smaller units, is particularly interesting: it allows for different shapes, with an increased number of microphones and improved performance, while keeping costs low. In this paper, full-digital microphone meta-arrays are presented: they are constituted by an arrangement of several triangular units, each featuring four digital Micro Electro-Mechanical Systems (MEMS) capsules connected in daisy-chain through the Automotive Audio Bus (A 2 B). Two prototypes have been built: a planar meta-array made of seven triangles (28 capsules) and a 3-dimensional meta-array with 14 triangles (56 capsules). Numerical simulations were carried out and compared against experimental measurements performed on the prototypes, showing an excellent matching. Finally, the 3-dimensional meta-array was compared with a spherical microphone array widely considered the state-of-the-art equipment in the last decade, demonstrating its potential in telecommunication applications.

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Beamforming with small diameter microphone array

Cited by 3 publications

References 13 publications

Design and implementation of dual pressure variation chambers for bone conduction microphone

Design and implementation of dual pressure variation chambers for bone conduction microphone

An Innovative Architecture of Full-Digital Microphone Arrays Over A²B Network for Consumer Electronics

Full-Digital Microphone Meta-Arrays for Consumer Electronics

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