2016
DOI: 10.1109/tcpmt.2016.2609400
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Barium Strontium Titanate Capacitor Fabrication on Copper Printed Circuit Board

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Cited by 2 publications
(1 citation statement)
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“…This leads to an interconnected porous dielectric in which the effect of inter‐crystalline barriers is minimized . This process has been used to prepare sol–gel composite BST films of 2.6 μm thickness for overlays on coplanar waveguides and voltage tunable microstrip resonators directly on printed circuit board . The effectiveness of this process is determined by the nature of the interface between the crystallized gel and the surface of the powder.…”
Section: Introductionmentioning
confidence: 99%
“…This leads to an interconnected porous dielectric in which the effect of inter‐crystalline barriers is minimized . This process has been used to prepare sol–gel composite BST films of 2.6 μm thickness for overlays on coplanar waveguides and voltage tunable microstrip resonators directly on printed circuit board . The effectiveness of this process is determined by the nature of the interface between the crystallized gel and the surface of the powder.…”
Section: Introductionmentioning
confidence: 99%