1997
DOI: 10.1016/s1359-6462(97)00267-4
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Ballistic penetration in thick copper plates: Microstructural characterization

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Cited by 18 publications
(13 citation statements)
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“…Microbands have been reported for copper targets and their density increased with impact velocity and increasing grain size of the target. [27] Typically, in FCC alloys with low stacking fault energy (SFE), microbands are promoted due to planar dislocation arrays. In contrast, dissociated dislocations may alternatively form twins and reduce driving force for microband formation.…”
Section: Partial Penetrationmentioning
confidence: 99%
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“…Microbands have been reported for copper targets and their density increased with impact velocity and increasing grain size of the target. [27] Typically, in FCC alloys with low stacking fault energy (SFE), microbands are promoted due to planar dislocation arrays. In contrast, dissociated dislocations may alternatively form twins and reduce driving force for microband formation.…”
Section: Partial Penetrationmentioning
confidence: 99%
“…These equiaxed ultrafine grains likely formed by significant dynamic recrystallization adjacent to ASBs, and the thickness of these regions increased with increasing impact velocity. [27] The formation of nanostructured and ultrafine grains inside the shear band by dynamic recrystallization has been widely studied. [31,53,54] During plastic deformation at high strain rates, there is a sudden rise in temperature inside the material that leads to thermal softening of localized regions.…”
Section: Plug Formationmentioning
confidence: 99%
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