2008 IEEE Aerospace Conference 2008
DOI: 10.1109/aero.2008.4526624
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Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST

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Cited by 22 publications
(11 citation statements)
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“…The IRFs have been modeled based on some IRF measurements. 2,5 In this model, a burst of IRF pulses is generated based on six parameters. These parameters are the following: The number of pulses in a burst (burst length).…”
Section: Intermittent Resistive Faults Modelmentioning
confidence: 99%
See 1 more Smart Citation
“…The IRFs have been modeled based on some IRF measurements. 2,5 In this model, a burst of IRF pulses is generated based on six parameters. These parameters are the following: The number of pulses in a burst (burst length).…”
Section: Intermittent Resistive Faults Modelmentioning
confidence: 99%
“…Finally after a while, they may evolve into a permanent fault. 2 Therefore, it is vital to detect and repair such faults before they become permanent and result in a system failure especially in safety-critical systems.…”
Section: Introductionmentioning
confidence: 99%
“…A capacitive open defect is generated by a large crack in a solder ball shown as an example as open#2 in Fig. 1 [11]. The defective interconnect is then modeled as a capacitor.…”
Section: Electrical Interconnect Test By a Built-inmentioning
confidence: 99%
“…Additional propagation delay is caused by such a resistance. The defective interconnect is built by a void or a small crack in a solder ball [11] and modeled as a resistor. The defect is denoted a "resistive open defect" in this paper.…”
Section: Electrical Interconnect Test By a Built-inmentioning
confidence: 99%
See 1 more Smart Citation