Back Propagation Neural Network in Predicting the Thermal Fatigue Life of Microelectronic Chips
Abstract:The present study gives an efficient approach to predict the thermal fatigue lives of microelectronic chips under cyclic thermal load using back propagation (BP) artificial neural network method. Strain based and stress-strain based thermal fatigue life models are established, respectively, according to the experimental results of thermal fatigue tests and the singularity parameters at the failure interface calculated by finite element method (FEM). According to the existing FEM results, the BP approach is con… Show more
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