2013
DOI: 10.1088/0022-3727/46/30/305501
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In situSEM electromechanical characterization of nanowire using an electrostatic tensile device

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Cited by 27 publications
(16 citation statements)
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“…Most studies on the piezoresistive effect of SiC NWs used the bottom up method to grow nanowires [106]- [109]. Shao et al [106] and Zeng et al [107] applied mechanical stress to 3C-SiC NWs by using piezoelectric and electrostatic actuators and measured the induced strain by SEM. The gauge factors reported by Shao et al and Zeng et al were −6.9 and 14.1 respectively, which is 2 to 4 times smaller than that of bulk 3C-SiC.…”
Section: B Piezoresistive Effect In Silicon Carbidementioning
confidence: 99%
“…Most studies on the piezoresistive effect of SiC NWs used the bottom up method to grow nanowires [106]- [109]. Shao et al [106] and Zeng et al [107] applied mechanical stress to 3C-SiC NWs by using piezoelectric and electrostatic actuators and measured the induced strain by SEM. The gauge factors reported by Shao et al and Zeng et al were −6.9 and 14.1 respectively, which is 2 to 4 times smaller than that of bulk 3C-SiC.…”
Section: B Piezoresistive Effect In Silicon Carbidementioning
confidence: 99%
“…The Young's modulus of copper deter mined from this formula equaled 43.5 GPa. This value is almost 2.5 times lower than the Young's modulus of bulk copper material (102.7 GPa [10]). An increase in the material ductility following a size reduction is typ ical for metallic crystal nanowires [11,12].…”
mentioning
confidence: 65%
“…3 . Two-terminal device was used to measure the resistivity of nanowire [ 25 ]. The wire was mechanically removed from the substrate by nano-operator equipped on focused ion beam (FIB) (FEI, QUANTA3D 600FIB System).…”
Section: Resultsmentioning
confidence: 99%
“…For FIB etching the root of the wire, a thin layer of Au was evaporated on the surface to protect the wire by electron-beam-induced deposition (EBID). Two-terminal device was used to measurement the resistivity of nanowire [ 25 ]. The wire was mechanically removed from the substrate by nano-operator equipped on focused ion beam (FIB) (FEI, QUANTA3D 600FIB System).…”
Section: Methodsmentioning
confidence: 99%