<b>An investigation into microstructure and particle distribution of Ni–P/diamond composite thin films</b>

Bozzini, Benedetto; Giovannelli, G.; Cavallotti, Pietro Luigi

doi:10.1046/j.1365-2818.1997.d01-615.x

Cited by 12 publications

(4 citation statements)

References 5 publications

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“…Spectra of cathodically charged alloys show that hydrogen is incorporated only in the low energy trap at 450°C. 7 This behavior is general for all the investigated Au-Cu-Cd alloys, irrespective of composition, structure, and morphology. Typical amounts of hydrogen incorporated under the above-described conditions are in the range of 0.3 to 0.7 mL g Ϫ1 .…”

Section: Resultsmentioning

confidence: 68%

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Effects of Cathodic Hydrogen Evolution on Electrodeposited Au-Cu-Cd Alloys

Bozzini

Cavallotti

2001

J. Electrochem. Soc.

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Hydrogen can be incorporated into electrodeposited Au alloys either during electrodeposition or by cathodic charging. Incorporated hydrogen in these alloys generally impairs their mechanical properties. In this work, we present results of a study of electrochemical, structural, surface composition, and morphological effects of cathodic charging of Au-Cu-Cd alloys electrodeposited from a cyanoalkaline bath. Different kinds of linear sweep voltammetric behaviors are observed for alloys with different compositions and for repeated scans, which is related to a loss of electrocatalytic activity for high Cu content alloys and prolonged cathodic charging. The surface composition of alloys is altered by cathodic charging, resulting in a decrease in Au content. The surface morphology, as observed by scanning electron and atomic force microscopies, is modified by cathodic charging: large crystallites are attacked and globular features appear on flat deposits. The crystallographic structure of the alloys is affected by prolonged hydrogen evolution; the original preferred orientation is disrupted and a Cu-rich phase appears.Electrodeposited Au-Cu-Cd has been in consistent use for decorative purposes ͑practically all of the electroforming of 14 to 18 carat Au hollow jewelry͒. The electronics industry is also interested in this material ͑high-performance electric contacts, sliding contacts, slip rings, connectors͒. The requirements for both electronic and decorative fields strongly stress the mechanical properties of the Au alloy layers ͑wear resistance, ductility, toughness͒. It has been proved in previous work 1,2 that hydrogen embrittlement is a major cause of mechanical failure of electroplated Au-based alloys. In this work, we report on compositional, structural, and morphological alterations brought about by hydrogen evolution on electrodeposited Au-Cu-Cd alloys of various compositions.Accurate but phenomenological studies of Au-Cu-Cd electrodeposited alloys were proposed in the 1970s and early 1980s. 3-5 More recent work is either focused on very specific problems such as pulse plating 6 or is markedly application-oriented. No description is found in the literature concerning hydrogen evolution effects on these alloys, apart from indirect data on cathodic efficiency. 3,4,6 Structural and morphological data are reported for ϳ18 carat deposits. 4,5 All authors agree on the fact that at least one Au-based disordered solid solution is observed. Steinmann et al. 5 report one such phase with strong ͑111͒ preferred orientation, while Dettke et al. 4 report somewhat doubtful evidence of a polyphasic structure with reflections form four superlattice structures. Materials and MethodsBaths and electrochemical experiments.-The investigated alloys were electrodeposited with the following bath and operating conditions: Au ͑as KAu͑CN͒ 2 ) 5 g L Ϫ1 , Cu ͑as KCu͑CN͒ 3 ) 50 g L Ϫ1 , CdCO 3 1.5 g L Ϫ1 , KCN 20 g L Ϫ1 , KHCO 3 7 g L Ϫ1 , and K 2 CO 3 5 g L Ϫ1 , pH 10.5, temp 70°C. Hydrogen evolution experiments were carried out in a 0.125 ...

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Section: Resultsmentioning

confidence: 68%

“…5a͒ consists of a granular structure with sharp ridges, very similar to those observed with Au-Cu alloys. 7 With larger amounts of codeposited Cu, a very smooth morphology is obtained ͑5 mA cm Ϫ2 , Fig. 5b͒, which tends first to develop a very slight waviness ͑10 mA cm Ϫ2 , Fig.…”

Section: Resultsmentioning

confidence: 99%

Effects of Cathodic Hydrogen Evolution on Electrodeposited Au-Cu-Cd Alloys

Bozzini

Cavallotti

2001

J. Electrochem. Soc.

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“…A variety of nanosized particles, such as Al 2 O 3 [3,26,27], C [28][29][30], SiO 2 [19,[31][32][33], ZrO 2 [34][35][36], SiC [24,[37][38][39][40] have been successfully co-deposited with several metals. Although nickel-titania composites have been reported to be advantageous for high temperature [41] and photoelectrochemical applications [6] relatively little research effort has been dedicated to the electrodeposition of nickel titania composites [6,7,41,42].…”

Section: Introductionmentioning

confidence: 99%

Characterization of electrodeposited Ni–TiO2 nanocomposite coatings

Thiemig

Bund

2008

Surface and Coatings Technology

154

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“…Electroless Ni-P composites are widely used in chemical, mechanical and electronic industries because of their wear and corrosion resistance properties [1,2]. Electroless composite plating is a kind of surface treatment technology developed on the basis of electroless plating.…”

Section: Introductionmentioning

confidence: 99%

Fabrications of Electroless Ni-P Composite Coatings before and after Annealing and Tribological Analyses

Chang

Hou

Ger

et al. 2015

KEM

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In the present study, SiC reinforced particles were introduced to the Ni-P plating bath, and developed high SiC content composite coatings. Thin films nature properties and mechanical performances were evaluated well. The results showed that the Ni-P alloy embedded SiC particles formed a few cavities, and reduced coatings hardness and wear resistance in as-plated condition. After 400°C heat-treatment, Ni3P crystalline phase formed and reached the max hardness, and conducted excellent trybological performances. SiC particles were decoposited in 600°C and reacted with Ni to form Ni3Si and Ni5Si2, caused the decreasing in hardness.

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An investigation into microstructure and particle distribution of Ni–P/diamond composite thin films

Cited by 12 publications

References 5 publications

Effects of Cathodic Hydrogen Evolution on Electrodeposited Au-Cu-Cd Alloys

Effects of Cathodic Hydrogen Evolution on Electrodeposited Au-Cu-Cd Alloys

Characterization of electrodeposited Ni–TiO2 nanocomposite coatings

Fabrications of Electroless Ni-P Composite Coatings before and after Annealing and Tribological Analyses

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