Autonomous Wireless Sensor Node with Thermal Energy Harvesting for Temperature Monitoring of Industrial Devices

Huang, Liqun; Tan, Shudong; Yang, Lei; Zhang, Zhijuan; Bergmann, Neil W.

doi:10.3991/ijoe.v13i04.6802

Cited by 6 publications

(2 citation statements)

References 6 publications

(8 reference statements)

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“…The harvester is enveloped around a heat pipe with a temperature of 70 °C , which ensures the energy autonomy and the battery charging. A similar architecture is proposed in [32]: in this case, two rigid TEGs are placed in contact with a hot wall, and the harvested energy is stored in a 4 F supercapacitor.…”

Section: Related Workmentioning

confidence: 99%

Providing Energy Self-Sufficiency to LoRaWAN Nodes by Means of Thermoelectric Generators (TEGs)-Based Energy Harvesting

et al. 2021

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The aim of this paper is to present the viability of an energy-harvesting system prototype, based on thermoelectric generators (TEGs), to be embedded in a Long-Range Wide Area Network (LoRaWAN)-based wireless sensor node, allowing continuous quasi-real-time data transmission even for low temperature gradients and for frequent transmissions. To this end, an RFM95x LoRa module is used in the system. The energy management of the entire node is achieved by exploiting a nano power boost charger buck converter integrated circuit, which allows power extraction from the energy-harvesting source and, at the same time, regulates the charging/discharging process of a Li-Po battery that supplies the wireless node. The first phase of the project was dedicated to understanding the electrical characteristics of the TEG. A series of tests were performed to study the open circuit voltage, the current and the power generated by the TEG at different temperature gradients. Following this first phase, tests were then set up to study the charging/discharging process of the battery by changing two crucial parameters: the temperature between the faces of the TEG and the frequency of the transmissions performed by the transceiver. Experimental results show a positive balance for the battery charging at different conditions, which suggests two important conclusions: first of all, with high temperature gradients, it is possible to set relatively high transmission frequencies for the LoRaWAN module without discharging the battery. The second important consideration concerns the operation of the system at extremely low temperature gradients, with a minimum of 5 °C reached during one of the measurements. This suggests the usability of thermoelectric energy-harvesting systems in a wide range of possible applications even in conditions of low temperature gradients.

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Section: Related Workmentioning

confidence: 99%

Providing Energy Self-Sufficiency to LoRaWAN Nodes by Means of Thermoelectric Generators (TEGs)-Based Energy Harvesting

et al. 2021

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“…This threedimensional (3D) technology represents the next wave of packaging innovation and will observe a sharp growth in the future [13]. There are often many hot walls or pipelines at industrial plants even when there is insufficient light or vibration for energy harvesting [18]. With the continuous improvement of technology, the cost of sensor nodes is decreasing and the function is stronger [19].…”

Section: Introductionmentioning

confidence: 99%

Ejectorless Method for Die Attach Pick Up for Cracking Improvement on Thin High-Aspect Ratio Die

Rahman

Nayan²

2020

Int. J. Onl. Eng.

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<p>The demand for producing small, thin, and light electronic devices is increasing. As a result, the design and assembly of electronic packaging technology have been developed. To meet the ever-increasing technology requirements, the critical process in the semiconductor packaging include wafer back grinding, sawing, and die attach. Given that the die thickness is lower than the previous ones, the risk of die cracking failures, which can lead to device malfunction, becomes high. In the die attach process, the ejector pin has an effect during the pick and place processes. Such impact may result in microdented mark or microcrack underneath the die, which becomes the weakened point throughout the entire process. In this study, an ejectorless system for the die pick and place during the die attach process has been designed and evaluated. The methodology of using ejector pin is replaced by heated static pillar inside cavity for die platform before being picked up. Vacuum is used to stabilize the die, and heat is applied to soften the sawing tape and weaken the adhesion of the die to the sawing tape. Results show that the critical issues of die crack for thin high aspect ratio die are resolved by using the proposed method for the die pick during the die attach process. In conclusion, the semiconductor packaging advances the pick-up technology solution for the challenging material, which is needed for the current miniaturization market trend and demand. <br /><br /></p>

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High-performance self-powered wireless sensor node driven by a flexible thermoelectric generator

Kim

et al. 2018

Energy

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Autonomous Wireless Sensor Node with Thermal Energy Harvesting for Temperature Monitoring of Industrial Devices

Cited by 6 publications

References 6 publications

Providing Energy Self-Sufficiency to LoRaWAN Nodes by Means of Thermoelectric Generators (TEGs)-Based Energy Harvesting

Providing Energy Self-Sufficiency to LoRaWAN Nodes by Means of Thermoelectric Generators (TEGs)-Based Energy Harvesting

Ejectorless Method for Die Attach Pick Up for Cracking Improvement on Thin High-Aspect Ratio Die

High-performance self-powered wireless sensor node driven by a flexible thermoelectric generator

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