DTCO and Computational Patterning II 2023
DOI: 10.1117/12.2662024
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Automatic generation of representative and diversified pattern samples from a full chip layout

Abstract: To successfully transfer design patterns to wafer, it is essential to calibrate different types of models to describe the optical, physical, and chemical effects in chip manufacturing process. In recent years, there have also been active investigations of machine learning (ML) models to capture various aspects of semiconductor processes. As it is well known, model training time and model accuracy are heavily influenced by the input data. It is becoming increasingly important to provide highly efficient methods… Show more

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“…Unfortunately, this method is quite slow, tedious, and not exhaustive. Another possibility is to extract the optimal test patterns either from a broader set of artificially generated layouts [1] or directly by analyzing production layouts using complex clustering [2,3], similarity grouping [4], or data reduction techniques [5,6,7]. But these methods may not be exhaustive if the database to profile is not representative enough of the design space.…”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, this method is quite slow, tedious, and not exhaustive. Another possibility is to extract the optimal test patterns either from a broader set of artificially generated layouts [1] or directly by analyzing production layouts using complex clustering [2,3], similarity grouping [4], or data reduction techniques [5,6,7]. But these methods may not be exhaustive if the database to profile is not representative enough of the design space.…”
Section: Introductionmentioning
confidence: 99%