2012
DOI: 10.1016/j.snb.2012.01.027
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Automated detection of particle concentration and chemical reactions in EWOD devices

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Cited by 21 publications
(11 citation statements)
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“…Chemical reactions can then take place as particles are introduced to a variety of reagents. In some cases, these reactions can change the dielectric coefficient or resistivity of the carrier fluid (Sadeghi et al 2012;Schertzer et al 2012). Here, the spectrum of impedance over a range of measurement frequencies can be used to monitor the reaction.…”
Section: Effect Of Fluidic Electrical Properties On Droplet Impedancementioning
confidence: 99%
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“…Chemical reactions can then take place as particles are introduced to a variety of reagents. In some cases, these reactions can change the dielectric coefficient or resistivity of the carrier fluid (Sadeghi et al 2012;Schertzer et al 2012). Here, the spectrum of impedance over a range of measurement frequencies can be used to monitor the reaction.…”
Section: Effect Of Fluidic Electrical Properties On Droplet Impedancementioning
confidence: 99%
“…In order to manipulate droplets in DMF devices, the droplet must be grounded and at least a portion of the contact line of the interface must be above the active electrode (Mugele and Baret 2005;Nelson and Kim 2012;Choi et al 2012). In the most common configuration, each addressable location in the device can be modeled as a resistor and capacitor in parallel (Lederer et al 2012;Sadeghi et al 2012;Schertzer et al 2012;Shih et al 2013). As such, previous investigations have used capacitance (Su et al 2004;Ren et al 2004;Su et al 2005;Gong and Kim 2008;Shih et al 2011;Yafia and Najjaran 2013) and impedance (Lederer et al 2012;Sadeghi et al 2012;Schertzer et al 2012;Shih et al 2013) measurements to provide real-time feedback at every addressable position in the device without requiring optical access, or increasing fabrication complexity.…”
Section: Introductionmentioning
confidence: 99%
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“…For example, input and output (including waste production) use reservoirs that are physically placed on the perimeter of the chip; the locations and roles of the reservoirs do not change when the DMFB is in use, so they are not reconfigurable. External devices such as sensors, mixers, and heaters may be placed at any location on the chip surface [17][18][19][20][21][22][23][24][25][26][27][28][29][30][31]; such locations can still perform the five basic operations, but are now enhanced with additional capabilities. Similarly, specialized electrodes can be fabricated to perform operations such as electroporation [12] or non-uniform splitting [32].…”
Section: Introductionmentioning
confidence: 99%