Automated, Complex Testing Of A 64:1 Readout Multiplexer For Infrared Focal Planes

Abstract

A 64-channel readout device with a 64:1 multiplexer output, designed for use in cryogenic, infrared focal plane applications, is being tested extensively in a production environment. For the test system, an existing product was modified and expanded to provide the accuracy, flexibility, and throughput needed to meet test requirements. Unique test approaches, coupled with innovative throughput enhancement techniques, streamlined operations to allow automated testing of 500 devices per day on one test set with minimum operator intervention. The system executes more than 20 sophisticated tests at wafer level, in order to grade each device as faulted or specification -acceptable. Confidence in the quality and reliability of the deliverable product has also been increased.Creative software modules were designed and integrated with a standard software package (developed and refined over 5 years of device testing), forming a test program which fulfills demanding test requirements. These new modules facilitate viewing of raw data, display of "quick-look" reduced data, failure analysis, and re-sorting of device grades after testing.Additional benefits derived from this development effort include automated testing of packaged parts at both ambient and cryogenic temperatures, and reduced characterization test time for similar devices.Anticipated future improvements include greater utilization of the pipeline processor already present in the system architecture, and continued development to generalize the software package to allow swift reconfiguration for testing other readouts and hybrid arrays of varying size and performance. ABSTRACTA 64-channel readout device with a 64:1 multiplexer output, designed for use in cryogenic, infrared focal plane applications, is being tested extensively in a production environment. For the test system, an existing product was modified and expanded to provide the accuracy, flexibility, and throughput needed to meet test requirements. Unique test approaches, coupled with innovative throughput enhancement techniques, streamlined operations to allow automated testing of 500 devices per day on one test set with minimum operator intervention. The system executes more than 20 sophisticated tests at wafer level, in order to grade each device as faulted or specification-acceptable. Confidence in the quality and reliability of the deliverable product has also been increased.Creative software modules were designed and integrated with a standard software package (developed and refined over 5 years of device testing), forming a test program which fulfills demanding test requirements. These new modules facilitate viewing of raw data, display of "quick-look" reduced data, failure analysis, and re-sorting of device grades after testing.Additional benefits derived from this development effort include automated testing of packaged parts at both ambient and cryogenic temperatures, and reduced characterization test time for similar devices.Anticipated future improvements include greater utilization of the pipe...