Auger Electron Spectroscopy (AES) and X-ray Photoelectron Spectroscopy (XPS) Profiling of Self Assembled Monolayer (SAM) Patterns Based on Vapor Deposition Technique

Abstract

It is crucial to develop novel metrology techniques in the semiconductor fabrication process to accurately measure a film’s thickness in a few nanometers, as well as the material profile of the film. Highly uniform trichlorosilane (1H,1H,2H,2H-perfluorodecyltrichlorosilane, FDTS) derived SAM film patterns were fabricated by several conventional semiconductor fabrication methods combined, including photolithography, SAM vapor deposition, and the lift-off technique. Substantial information can be collected for FDTS SAM film patterns when Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) techniques are incorporated to investigate this material. Precise two-dimensional (2D) FDTS SAM film patterns were reconstructed through mapping analysis of corresponding elements and chemical state peaks by AES and XPS. Additionally, three-dimensional (3D) FDTS SAM film patterns were also reconstructed layer by layer through gas cluster ion beam (GCIB) etching and XPS analysis. These characterization results demonstrate that FDTS SAM film patterns based on the vapor deposition method are highly uniform because the vacuum and precise gas-delivery system exclude ambient environmental interference efficiently and ensure reaction process repeatability. AES and XPS techniques could be used for metrology applications in the semiconductor process with high-quality SAM microstructures and nanostructures.

XPS depth profiling of functional materials: applications of ion beam etching techniques

“…After exposure to the GCIB, decomposition of the alkane chain of the organic fragment and cleavage of the thiol–Au bond were observed at the earlier etching stage. Also, GICB sputtering was used to etch SAM patterns of trichlorosilane (1 H ,1 H ,2 H ,2 H -perfluorodecyltrichlorosilane, FDTS) on a silicon wafer for profiling and reconstructing the three-dimensional SAM patterns, 88 which demonstrated that FDTS SAM film patterns should be highly uniform. These results attested that the GCIB technique could be used as an efficient metrology for profiling film and layer-like materials.…”

One‐Pot Synthesis of Luminescent and Photothermal Carbon Boron‐Nitride Quantum Dots Exhibiting Cell Damage Protective Effects

“…This technique is ideal as it gives information on the oxidation states and chemical environment of the studied species and allows estimation of the surface elemental composition once the relevant atomic sensitivity factors have been considered. [42][43][44][45][46] Figure 1C shows the highresolution XP spectrum of the functionalized carbon-BNQDs in C1s, B1s, N1s, and O1s energy region. In particular, in the C 1s binding energy region, the fitting of the spectrum required five Gaussian components centered at 285.0, 286.3, 288.0, 289.4, and 293.3 eV.…”

Exploring the Depths of Corrosion: A Novel GE-XANES Technique for Investigating Compositionally Complex Alloys

“…Surface characterization is not trivial and requires the use of several analytical methods with different characteristics. A summary of these characteristics for most common surface analysis techniques is listed in Table . − These standard methods provide information only to a depth of some tens of nanometers. Since corrosive environmental conditions can lead to the development of several oxide layers of different morphologies and chemical nature on the sample surface in the case of CCAs with various layer thickness, deeper layers cannot be analyzed with abovementioned methods.…”