Atomistic modeling of resistivity evolution of copper nanoparticle in intense pulsed light sintering process

Meng, Lingbin; Zhang, Yi; Yang, Xuehui; Zhang, Jing

doi:10.1016/j.physb.2018.11.036

Cited by 10 publications

(4 citation statements)

References 30 publications

(53 reference statements)

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“…As an emerging field, the mechanism of metal particles melting in micro-scale has attracted many researchers. A series of two-particle melting molecular dynamic models of nickel [39], iron [40], copper [41], and silver [42] have been performed using the Nose-Hoover thermostat by Jing Zhang's team. The average temperature history curves of whole systems can be derived along with the diffusion patterns of two heated particles.…”

Section: D Stress Quantificationmentioning

confidence: 99%

Micro-scale thermodynamic model of microstructure and stress evolution in parts via selective laser melting

Fang

Huang

et al. 2022

J Mater Sci

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The thermodynamic state changes during selective laser melting (SLM) processing dominate the microstructure and mechanical properties of the built parts. Improper operational parameters often lead to uneven microscopic morphology, microcracks, distortions, and other failures. The key to controlling the microstructure of the forming metal lies in an in-depth understanding of the micro-scale thermodynamics of this process. A micro-scale thermodynamic model was developed herein to predict the microstructure and internal stress evolution in parts fabricated by SLM with two typical scanning strategies. The modified two-temperature (TTM) model was employed to discover the dominant interface thermodynamic phenomenon in unitary path scanning and the novel symmetrical multi-path scanning capable of reliving residual stress and homogenizing microstructure. The real-time identifying method of temperature, microstructure, and stress could be further applied to closed-loop control of the SLM process.

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Section: D Stress Quantificationmentioning

confidence: 99%

Micro-scale thermodynamic model of microstructure and stress evolution in parts via selective laser melting

Fang

Huang

et al. 2022

J Mater Sci

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“…The IPL post-treatment process has a variety of advantages. First, it can be applied to various types of functional materials such as metals [11][12][13][14][15][16][17][18], semiconductors [19][20][21][22][23][24], and dielectrics [25][26][27][28] due to wide wavelength characteristics. Each material has its own light absorption, followed by heat emission, characteristics depending on the wavelength.…”

Section: Introductionmentioning

confidence: 99%

“…Among them, the IPL posttreatment method has been proposed as the most suitable mean in device fabrication. The silver and copper nanostructures in the form of nanoparticle [11][12][13][14][15][16][17][18] and nanowire [51][52][53][54][55][56] were mainly used as conductive materials in IPL post-treatment. The IPL process has been utilized to modify characteristics of the functional materials adequately.…”

Section: Introductionmentioning

confidence: 99%

A review on intense pulsed light process as post-treatment for metal oxide thin films and nanostructures for device application

Noh¹,

Kim²,

Lee³

et al. 2022

Nanotechnology

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The intense pulsed light (IPL) post-treatment process has attracted great attention in the device fabrication due to its versatility and rapidity particularly for solution process functional structures in devices, flexible/printed electronics, and continuous manufacturing process. The metal oxide materials inherently have multi-functionality and have been widely used in form of thin films or nanostructures in device application such as thin-film transistors, light-emitting diodes, solar cells, supercapacitors, etc. The IPL treatment enhances the physical and/or chemical properties of the functional metal oxide through photothermal effects. However, most metal oxides are transparent to most range of visible light and require more energy for post-treatment. In this review, we have summarized the IPL post-treatment processes for metal oxide thin films and nanostructures in device applications. The sintering and annealing of metal oxides using IPL improved the device performances by employing additional light absorbing layer or back-reflector. The IPL process becomes an innovative versatile post-treatment process in conjunction with multi-functional metal oxides in near-future device applications.

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“…Metal@metal oxide (M@MO) core@shell nanoparticles (NPs) gather immense research interest as their properties can be tailored for various applications, such as sensing, , photocatalysis, , and dye-sensitized solar cells. , Oxide shells on metal cores are also used to suppress sintering between catalytic NPs. , In a broad range of applications, sintering (or coalescence) of NPs is a common phenomenon that can be advantageous , or undesired. , Molecular dynamics (MD) simulations have been extensively employed in studying sintering of metals, − metal oxides, − and bimetallic core@shell NPs. , However, no MD studies of the sintering mechanisms of M@MO core@shell NPs have been reported to date.…”

Section: Introductionmentioning

confidence: 99%

Sintering Mechanism of Core@Shell Metal@Metal Oxide Nanoparticles

et al. 2021

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Metal oxide shell layers are promising candidates to improve the performance of metal nanoparticles (NPs) in various applications. However, despite a significant amount of experimental work on metal@ metal oxide (M@MO) NPs, computational modeling is scarce, particularly on the sintering mechanism, which plays a crucial role in both the synthesis and performance of NPs. Here, we present atomic diffusion and sintering dynamics of M@MO NPs investigated using molecular dynamics based on the ReaxFF potentials. The coalescence process of the metal NPs with amorphous oxide shell is mainly facilitated by the relatively mobile surface atoms and grain-boundary-like diffusion, and thus, it is similar to reported mechanisms for crystalline nanoparticles. Intriguingly, atomic trajectory tracing reveals that surface diffusion is highly localized, contrary to the common understanding of freely moving high-mobility surface atoms. These atomic descriptions provide valuable insights for designing functional NPs with oxide layers and establishing more accurate accounts of the sintering mechanism.

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Atomistic modeling of resistivity evolution of copper nanoparticle in intense pulsed light sintering process

Cited by 10 publications

References 30 publications

Micro-scale thermodynamic model of microstructure and stress evolution in parts via selective laser melting

Micro-scale thermodynamic model of microstructure and stress evolution in parts via selective laser melting

A review on intense pulsed light process as post-treatment for metal oxide thin films and nanostructures for device application

Sintering Mechanism of Core@Shell Metal@Metal Oxide Nanoparticles

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