Abstract:This study presents an investigation on the role of temperature on the failure of diffusion-bonded Aluminium and Nickel. During diffusion bonding processes, where the bulk materials is subjected to join at the temperature of 300 K, 500 K, and 700 K with pressure of 10 MPa for 200 ps, the applied temperature is significantly influencing the final result of diffusion-bonded Al-Ni both in term of qualitative analysis (diffusion behaviour) and quantitative calculation (concentration distribution). In this case, as… Show more
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