2012
DOI: 10.1116/1.4750372
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Atomically precise surface engineering of silicon CCDs for enhanced UV quantum efficiency

Abstract: The authors report here on a new technique, combining the atomic precision of molecular beam epitaxy and atomic layer deposition, to fabricate back illuminated silicon CCD detectors that demonstrate world record detector quantum efficiency (>50%) in the near and far ultraviolet (155-300 nm). This report describes in detail the unique surface engineering approaches used and demonstrates the robustness of detector performance that is obtained by achieving atomic level precision at key steps in the fabrication pr… Show more

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Cited by 15 publications
(12 citation statements)
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“…The first time JPL passivated a CCD using MBE, the passivation layer comprised 5 nm of silicon doped at 3 × 10 20 B/cm −3 , i.e ., 3-D doping, plus a sacrificial 1-nm un-doped silicon cap layer to form the surface oxide [ 29 ]. In all subsequent devices, JPL has used 2D doping for surface passivation [ 17 , 18 , 28 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 ]. During MBE growth, a thin layer of un-doped silicon is grown on the substrate to form an atomically clean, uniform silicon surface.…”
Section: Materials and Methods: Silicon And Gallium Nitride/galliumentioning
confidence: 99%
“…The first time JPL passivated a CCD using MBE, the passivation layer comprised 5 nm of silicon doped at 3 × 10 20 B/cm −3 , i.e ., 3-D doping, plus a sacrificial 1-nm un-doped silicon cap layer to form the surface oxide [ 29 ]. In all subsequent devices, JPL has used 2D doping for surface passivation [ 17 , 18 , 28 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 ]. During MBE growth, a thin layer of un-doped silicon is grown on the substrate to form an atomically clean, uniform silicon surface.…”
Section: Materials and Methods: Silicon And Gallium Nitride/galliumentioning
confidence: 99%
“…[1][2][3][4] Using ALD, we have further demonstrated world record QE at deep and far ultraviolet wavelengths. [5][6][7] With the recent acquisition and commissioning of a production-scale silicon MBE system, JPL has greatly expanded its capabilities for producing high-performance delta-doped, back-illuminated imaging arrays with high throughput and high yield ( Figure 1). 4,8 Using this system, we demonstrated superlattice-doped CMOS imaging arrays with unprecedented stability under direct illumination with pulsed deep ultraviolet (DUV) lasers.…”
Section: Challenge and Paradox: Atomic Scale Control Over Surfaces Anmentioning
confidence: 99%
“…31 In all subsequent devices, JPL has used 2D doping for surface passivation. [1][2][3][4][5][6][7][8][9][10][11] The advantages of 2D-doping over 3D-doping are described in detail below.…”
Section: 1mentioning
confidence: 99%
“…For future implementations on active Si sensors ALD is an attractive choice due to its demonstrated efficacy at preserving detector QE in the UV, which is strongly dependent on the electrical quality of the illuminated surface [1]. ALD has been shown to be superior to other dielectric deposition techniques such as sputtering at maintaining UV QE [23], and may be effective at preventing additional surface damage during the evaporation or sputtering of subsequent metal layers.…”
Section: Methodsmentioning
confidence: 99%