Abstract:Atomic layer deposition (ALD) is
a viable method for depositing
functional, passivating, and encapsulating layers on top of halide
perovskites. Studies in that area have only focused on metal oxides,
despite a great number of materials that can be made with ALD. This
work demonstrates that, in addition to oxides, other ALD processes
can be compatible with the perovskites. We describe two new ALD processes
for lead sulfide. These processes operate at low deposition temperatures
(45–155 °C) that have been inacce… Show more
“…Interest in applications of MCs and particularly TMCs within next‐generation electronics has risen steeply over the past decade, driven by their intrinsic layered crystal structures and unique properties. [ 193 , 209 ] TMCs typically consist of a metal/chalcogen atomic ratio of 1:2, although exceptions of 1:1, [ 210 , 211 ] and 2:3 [ 212 ] are possible. TMCs have three classical polymorphs, which are tetragonal (1T), hexagonal symmetry (2H), and rhombohedral (3R).…”
Section: Ald Of Metal Chalcogenides For Fetsmentioning
confidence: 99%
“…Aside from Mo, W, and Sn‐based MCs, the fabrication of alternative MC materials such as lead sulfide (PbS), manganese sulfide (MnS), and rhenium disulfide (ReS 2 ) is possible using ALD, [ 210 , 281 , 282 ] with their development for electronic applications attracting growing interest. [ 238 , 283 ] MnS, is a p‐type semiconductor with a wide bandgap of 3.7 eV, and it has been deposited with crystal phase‐control by ALD using bis(ethylcyclopentadienyl)Mn(II) (Mn(EtCp) 2 ) and H 2 S precursors.…”
Section: Ald Of Metal Chalcogenides For Fetsmentioning
confidence: 99%
“…Very recently, uniform and crystalline PbS thin‐films have been produced by low‐temperature ALD using rac‐N 2 ,N 3 ‐di‐tert‐butylbutane‐2,3‐diamide lead [Pb(dbda)] and bis(trimethylsilyl)‐amide lead [Pb(btsa) 2 ] as lead precursors, with H 2 S as a sulfur source. [ 210 ] The PbS films exhibited typical p‐type behaviors with excellent mobility up to 70 cm 2 V −1 s −1 . Lead chalcogenides are a well‐established class of ambipolar semiconductors, with carrier transport determined by an excess of either metal or chalcogen within the crystal structure.…”
Section: Ald Of Metal Chalcogenides For Fetsmentioning
Atomic layer deposition (ALD) is a deposition technique well‐suited to produce high‐quality thin film materials at the nanoscale for applications in transistors. This review comprehensively describes the latest developments in ALD of metal oxides (MOs) and chalcogenides with tunable bandgaps, compositions, and nanostructures for the fabrication of high‐performance field‐effect transistors. By ALD various n‐type and p‐type MOs, including binary and multinary semiconductors, can be deposited and applied as channel materials, transparent electrodes, or electrode interlayers for improving charge‐transport and switching properties of transistors. On the other hand, MO insulators by ALD are applied as dielectrics or protecting/encapsulating layers for enhancing device performance and stability. Metal chalcogenide semiconductors and their heterostructures made by ALD have shown great promise as novel building blocks to fabricate single channel or heterojunction materials in transistors. By correlating the device performance to the structural and chemical properties of the ALD materials, clear structure–property relations can be proposed, which can help to design better‐performing transistors. Finally, a brief concluding remark on these ALD materials and devices is presented, with insights into upcoming opportunities and challenges for future electronics and integrated applications.
“…Interest in applications of MCs and particularly TMCs within next‐generation electronics has risen steeply over the past decade, driven by their intrinsic layered crystal structures and unique properties. [ 193 , 209 ] TMCs typically consist of a metal/chalcogen atomic ratio of 1:2, although exceptions of 1:1, [ 210 , 211 ] and 2:3 [ 212 ] are possible. TMCs have three classical polymorphs, which are tetragonal (1T), hexagonal symmetry (2H), and rhombohedral (3R).…”
Section: Ald Of Metal Chalcogenides For Fetsmentioning
confidence: 99%
“…Aside from Mo, W, and Sn‐based MCs, the fabrication of alternative MC materials such as lead sulfide (PbS), manganese sulfide (MnS), and rhenium disulfide (ReS 2 ) is possible using ALD, [ 210 , 281 , 282 ] with their development for electronic applications attracting growing interest. [ 238 , 283 ] MnS, is a p‐type semiconductor with a wide bandgap of 3.7 eV, and it has been deposited with crystal phase‐control by ALD using bis(ethylcyclopentadienyl)Mn(II) (Mn(EtCp) 2 ) and H 2 S precursors.…”
Section: Ald Of Metal Chalcogenides For Fetsmentioning
confidence: 99%
“…Very recently, uniform and crystalline PbS thin‐films have been produced by low‐temperature ALD using rac‐N 2 ,N 3 ‐di‐tert‐butylbutane‐2,3‐diamide lead [Pb(dbda)] and bis(trimethylsilyl)‐amide lead [Pb(btsa) 2 ] as lead precursors, with H 2 S as a sulfur source. [ 210 ] The PbS films exhibited typical p‐type behaviors with excellent mobility up to 70 cm 2 V −1 s −1 . Lead chalcogenides are a well‐established class of ambipolar semiconductors, with carrier transport determined by an excess of either metal or chalcogen within the crystal structure.…”
Section: Ald Of Metal Chalcogenides For Fetsmentioning
Atomic layer deposition (ALD) is a deposition technique well‐suited to produce high‐quality thin film materials at the nanoscale for applications in transistors. This review comprehensively describes the latest developments in ALD of metal oxides (MOs) and chalcogenides with tunable bandgaps, compositions, and nanostructures for the fabrication of high‐performance field‐effect transistors. By ALD various n‐type and p‐type MOs, including binary and multinary semiconductors, can be deposited and applied as channel materials, transparent electrodes, or electrode interlayers for improving charge‐transport and switching properties of transistors. On the other hand, MO insulators by ALD are applied as dielectrics or protecting/encapsulating layers for enhancing device performance and stability. Metal chalcogenide semiconductors and their heterostructures made by ALD have shown great promise as novel building blocks to fabricate single channel or heterojunction materials in transistors. By correlating the device performance to the structural and chemical properties of the ALD materials, clear structure–property relations can be proposed, which can help to design better‐performing transistors. Finally, a brief concluding remark on these ALD materials and devices is presented, with insights into upcoming opportunities and challenges for future electronics and integrated applications.
“…Recently, PbS was deposited using the dicoordinated Pb–N bonded hexamethyldisilazide and cyclic diamide precursors, rendering near stochiometric films with low levels of carbon impurities. 29 However, the deposition temperature for ALD growth was limited to ≤155 °C due to the poor thermal stability of the deposited surface species. Volatility data have not been reported for the tetracoordinated Ge(II) and Pb(II) amidinates in the literature.…”
Only a few M–N
bonded divalent group 14 precursors are available
for vapor deposition, in particular for Ge and Pb. A majority of the
reported precursors are dicoordinated with the Sn(II) amidinates,
the only tetracoordinated examples. No Ge(II) and Pb(II) amidinates
suitable for vapor deposition have been demonstrated. Herein, we present
tetracoordinated Ge(II), Sn(II), and Pb(II) complexes bearing two
sets of chelating 1,3-di-
tert
-butyltriazenide ligands.
These compounds are thermally stable, sublime quantitatively between
60 and 75 °C (at 0.5 mbar), and show ideal single-step volatilization
by thermogravimetric analysis.
“…27,28 The amidinate ligand system provides a tetracoordinated, thermally stable and volatile precursors that afford high-quality SnS films with low levels of impurities. More recently, the first example of ALD grown PbS 29 using Pb-N bonded dicoordinated hexamethyldisilazide 25,30 and cyclic diamide 31 precursors.…”
<p>The number of M–N bonded divalent group 14 precursors suitable for
atomic layer deposition is limited, in particular for Ge and Pb. A majority of
the reported precursors are dicoordinated, with the only tetracoordinated example
being the Sn(II) amidinate. No such Ge(II) and Pb(II) compounds have been
demonstrated. Herein, we present tetracoordinated Ge(II), Sn(II) and Pb(II) complexes
bearing two sets of the bidentate 1,3-di-<i>tert</i>-butyl triazenide ligands. These
compounds are highly volatile and show ideal behavior by thermogravimetric
analysis. However, they have unusual thermal properties and exhibit instability
during sublimation. Interestingly, the instability is not only temperature
dependent but also facilitated by reduced pressure. Using quantum-chemical
density functional theory, a gas-phase decomposition pathway was mapped out.
The pathway account for the unusual thermal behavior of the compounds and is
supported by electron impact mass spectrometry data.</p>
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.