1994
DOI: 10.1246/cl.1994.1905
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Atomic Force Microscopic Observation of Plasma Polymerized Film. Hexamethylcyclotrisiloxane, Hexamethyldisiloxane, and Pyrrole as the Monomers

Abstract: Atomic force microscopic observations of plasma polymerized thin films of the three monomers, hexamethylcyclotrisiloxane, hexamethyldisiloxane, and pyrrole, were made. The polymerization processes under fixed plasma conditions were followed with the reaction time. The differece of the polymerization rate between these monomers was clearly obtained by AFM observation.

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Cited by 4 publications
(3 citation statements)
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“…In order to complement infrared characterization, the pressure changes upon plasma ignition are monitored and the surfaces of the plasma treated polymer films are characterized by water advancing and receding contact angle measurements,39'32 and atomic force microscopy. [22][23][24][25][26][27][28][29][30][31][32][33][34][35] Similar investigations on polyethylene surfaces are described briefly.…”
Section: Downstream Nitrogen Trifluoride Plasma Treatmentsmentioning
confidence: 99%
“…In order to complement infrared characterization, the pressure changes upon plasma ignition are monitored and the surfaces of the plasma treated polymer films are characterized by water advancing and receding contact angle measurements,39'32 and atomic force microscopy. [22][23][24][25][26][27][28][29][30][31][32][33][34][35] Similar investigations on polyethylene surfaces are described briefly.…”
Section: Downstream Nitrogen Trifluoride Plasma Treatmentsmentioning
confidence: 99%
“…To name but a few results, the growth kinetics of electrochemically deposited poly(phenylene oxide) films on gold was characterized to commence with a rapid deposition followed by mass transport controlled growth , …”
Section: Introductionmentioning
confidence: 99%
“…18 Plasma polymer films of monomers, such as hexamethylcyclotrisiloxane, hexamethyldisiloxane, and pyrrole, can be smooth and pinhole-free with only 2-10 nm thickness. 19,20 AFM inherently has no access to the actual interface between film and substrate since it images the surface. Approaches to image the "interface" after removal of substrate or film 21 bear the uncertainty of how the original interface was modified due to the removal process.…”
Section: Introductionmentioning
confidence: 99%