We present first-principles calculations for the atomic and electronic structure of GaN/ZrB 2 interfaces to provide microscopic information on GaN epitaxy on ZrB 2 substrates. Both GaN epilayer and ZrB 2 substrate almost maintain the bulk structures when the epitaxial growth begins with the formation of N-Zr bonds. On the other hand, a remarkable zigzag structural change, which seems to deteriorate the latticematched nature of ZrB 2 substrates, is found in the interfacial B-plane when B-N bond formation occurs at the interface. These results indicate that suppression of B-N bond formation is a key point for the effective use of ZrB 2 as a substrate of GaN. We also estimate the Schottky barrier heights of these interfaces. For the interface, which contains three N-Zr bonds, the calculated p-type Schottky barrier height is small enough to form ohmic contacts.1 Introduction GaN is one of the most attractive material for blue light emitting diodes and lasers, and also expected as a material for high-power, high-temperature, and high-frequency electronic devices. To improve the quality of GaN single crystals, many efforts are paid to devise growth techniques as well as to search more suitable, namely lattice-and thermal-expansion-coefficient-matched, substrates. Recently, Kinoshita et al. [1] have reported that ZrB 2 is a promising substrate for epitaxial growth of GaN, because it has hexagonal (AlB 2 -type) structure, the lattice-mismatch is only 0.6%, and the thermal expansion coefficient is very close to that of GaN [1][2][3]. Furthermore, since ZrB 2 is a metallic compound with highelectrical and -thermal conductivity [1,2], the substrate may be used directly as a part of GaN-based devices. In this paper, we present first-principles calculations for the atomic-and electronic-structure of GaN/ZrB 2 interfaces in order to provide microscopic information on GaN epitaxy on ZrB 2 . We also present a theoretical prediction on the Schottky barrier heights (SBH) of the GaN/ZrB 2 interfaces, which is one of the important quantities for metal/semiconductor device applications.