“…Using this molding technique, it is possible to produce particle boards with a thickness of around 6 mm, obtaining density values between 1150 and 1350 kg/m 3 , thermal conductivity of 0.35 W/mK, and compressive strength and modulus of elasticity of 15 MPa and 4.5 GPa, respectively. They achieve adequate mechanical strength for non-structural applications [6,7,27,28,[33][34][35] and are classified as excellent materials in terms of hygrothermal performance [36]. These materials are generally used for façade cladding and insulation, partition walls, ceiling cladding, and interior decoration.…”