Assembly of mobile 5G transceiver based on photonic motherboard

Abstract

We describe the assembly of a 5G transceiver leveraging photonics for the generation, emission and detection of THz wireless signals. The transceiver and all associated control electronics and power supplies are designed for mounting in a mobile aerial unit. A photonics motherboard concept that brings together polymer, III-V and SiNbased photonic platforms and provides optical fiber connectivity is used for the assembly. In addition, scalable integration of 3D components, in this case an antenna rod or rod array, is demonstrated. Thermal considerations arising from the dense integration of photonic and electronic components and the resulting concentrated heat load are also discussed.

Industrial photonics packaging for high volume applications

“…The detailed description of the assembly processes was described in Ref. [4] and will not be further discussed in this manuscript.…”