Assembly development of 1.3 Tb/s full duplex optical module

Benjamin, Yehoshua; Hasharoni, Kobi; Mesh, Michael

doi:10.1109/ectc.2013.6575586

Cited by 11 publications

(4 citation statements)

References 6 publications

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“…Many groups have explored wavelengths of 980 nm and longer in the con-text of data transmission [1,6]. Beyond their resistance to high-stress conditions, the motivation for using 980 nm, particularly in comparison with 940 nm, is the potential for employing VCSELs in bottom emitter configuration where the light exits from the from the backside of the GaAs substrate.…”

Section: Vcsels For Automotive Applicationsmentioning

confidence: 99%

Optical neurons to interconnect sensors and artificial brains in autonomous vehicles

Pérez‐Aranda,

Pankert

2023

PhotonicsViews

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With the ever‐increasing need for faster data communication in cars, electrical interconnects are beginning to show bandwidth and electromagnetic compatibility limitations. The new IEEE 802.3cz ethernet physical layer has been developed specifically to meet these needs, based on a long‐wavelength multimode VCSEL (vertical cavity surface‐emitting laser) and mature bend‐insensitive multimode fibers. A major innovation is taking place that will make automotive‐grade, multigigabit optical transceivers possible.

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Section: Vcsels For Automotive Applicationsmentioning

confidence: 99%

Optical neurons to interconnect sensors and artificial brains in autonomous vehicles

Pérez‐Aranda,

Pankert

2023

PhotonicsViews

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“…As shown in Fig. 5, the transmission loss is 1.7 dB [S(4,1)] and 0.4 dB [S(6,5)] at 50 GHz, respectively, for paths 0 and 11, and the reflection [S(1,1) and S (5,5)] is below −20 dB. In addition, the channel crosstalk is also simulated: both near-end crosstalk (NEXT) and far-end crosstalk (FEXT) between two long traces are below −25 dB, shown in Fig.…”

Section: Design Of the Electrical Interfacementioning

confidence: 99%

“…Further scaling optical interconnects in density through making 2-D matrix of emitters and detectors is difficult, due to the high cost of 2-D optical chips and associated packaging issues. Previously, 2-D optical array copackaged on an active CMOS driver/router chip has been developed [5], [6]; however, the whole packaged scheme required fully dedicated 2-D optoelectronic and application-specified integrated circuit (ASIC) chips designs. The optoelectronics were assembled on the active CMOS chip, which inevitably consumes valuable silicon area and increases the associated costs.…”

Section: Introductionmentioning

confidence: 99%

48-Channel Matrix Optical Transmitter on a Single Direct Fiber Connector

Zhang

et al. 2018

IEEE Trans. Electron Devices

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published version features the final layout of the paper including the volume, issue and page numbers. Link to publication General rightsCopyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights.• Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain • You may freely distribute the URL identifying the publication in the public portal.If the publication is distributed under the terms of Article 25fa of the Dutch Copyright Act, indicated by the "Taverne" license above, please follow below link for the End User

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“…Several studies have been conducted on high-speed, multi-channel optical transceivers that use flexible printed circuits (FPCs) in combination with polymer optical waveguides [3], [4]. This is because an architecture that uses an FPC with a polymer waveguide is one of the most promising candidates for potentially enabling high-density and low-cost production.…”

Section: Introductionmentioning

confidence: 99%

40-Gb/s card-edge connected optical transceiver using novel high-speed connector

Yagisawa

Shiraishi

Sugawara

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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A novel card-edge connector is proposed that achieves high-speed and compactness through the use of a novel structure with sub-assemblies of a terminal electrode module. An eight-channel double-sided mount, card-edge-connected optical transceiver module was developed by using the connector and our enabling technologies consisting of a highspeed FPC connector, an inductive peaking line, and an integrated lens on a photo diode. Clear eye openings and error-free operation were obtained at 40 Gb/s. IntroductionOptical interconnection is one of the key technologies for overcoming bandwidth bottlenecks in high-performance computing systems and high-end servers [1], [2]. Several studies have been conducted on high-speed, multi-channel optical transceivers that use flexible printed circuits (FPCs) in combination with polymer optical waveguides [3], [4]. This is because an architecture that uses an FPC with a polymer waveguide is one of the most promising candidates for potentially enabling high-density and low-cost production.We previously proposed an optical transceiver based on optical engines (OEs) that use polymer waveguides and FPCs. The FPC based optical engine (FPC-OE) is composed of a vertical-cavity surface-emitting laser (VCSEL) array, a driver, a photodiode (PD) array, and a transimpedance amplifier (TIA) mounted by flip-chip bonding on the FPC [5]. A thin microlens-imprinted film is attached to the bottom of the FPC. The film is then pasted on a polymer waveguide that has a 45° mirror. The FPC has through-holes just beneath the VCSEL and PD so that the FPC does not interfere with the lens structure, as shown in Fig. 1. These simple passivealignment processes reduce the assembly cost. We also reported that the FPC-OE successfully operated at up to 40 Gb/s by employing a high-speed FPC connector [6] and an integrated lens using inkjet technology for a small-diameter PD to extend the frequency bandwidth on electrical and optical packaging [7].We also proposed an eight-channel double-sided mount, card-edge-connected optical transceiver module (DCOM) that uses the FPC-OEs. The FPC-OEs are placed and connected on both surfaces of the transceiver substrate with FPC connectors. The transceiver has a card-edge electrical interface and is mounted on a board with a right-angle cardedge connector. The advantages of this module are its reduced footprint size and effective utilization of the vertical dimension [9]. The compactness and high-speed characteristics of the DCOM structure strongly depend on the

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Assembly development of 1.3 Tb/s full duplex optical module

Cited by 11 publications

References 6 publications

Optical neurons to interconnect sensors and artificial brains in autonomous vehicles

Optical neurons to interconnect sensors and artificial brains in autonomous vehicles

48-Channel Matrix Optical Transmitter on a Single Direct Fiber Connector

40-Gb/s card-edge connected optical transceiver using novel high-speed connector

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