Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder

Arulvanan, P.; Zhong, Zhang

doi:10.1016/j.mee.2006.05.002

Cited by 24 publications

(11 citation statements)

References 23 publications

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“…Four no‐clean, SnAgCu alloy‐based solder pastes consisting of different flux systems were also evaluated experimentally (Manjunath et al , 2006). There are also recent reports on reliability of SnAgCu solder (Arulvanan and Zhong, 2006; Braun et al , 2006; Roellig et al , 2007).…”

Section: Introductionmentioning

confidence: 99%

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Zhong

Arulvanan

Maw

et al. 2007

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag or AgPd pads using SnAgCu or SnPb solder and the results of the characterization of the solder joints.Design/methodology/approachLTCC substrates were fabricated by stacking and laminating four green tapes with the top layer screen‐printed with Ag or AgPd paste to form pads. Silicon die sizes of 1 × 1 mm and 2 × 2 mm with electroless nickel immersion gold plated were soldered to 2 × 2 mm pads on the LTCC substrates using SnPb or SnAgCu solder. The solder joints were then characterized using X‐ray, die shear, energy dispersive X‐ray and scanning electron microscopy techniques.FindingsThe joints made by AgPd pads with SnAgCu solder provided the best results with the highest shear strength having strong interfaces in the joints. However, the joints of Ag pads with SnPb solder did not provide high‐shear strength.Originality/valueThe findings provide certain guidelines to implement LTCC applications. AgPd pads with SnAgCu solder can be considered for applications where small silicon dies need to be attached to LTCC substrates. However, Ag pads with SnAgCu solder can be considered for lead‐free solder applications.

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Section: Introductionmentioning

confidence: 99%

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Zhong

Arulvanan

Maw

et al. 2007

Soldering &Amp; Surface Mount Technology

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“…This kind of compound formed on the interface between soldering tin and the metals of base material is called IMC. As to whether an IMC is weak or strong is one of the main factors determining the cracking and damage of solder joint [1,5,11,13,18]. When the thickness of IMC is increased, the ratio of tensile strength to initial value will be decreased accordingly.…”

Section: Soldering In Smtmentioning

confidence: 99%

Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes

Shu¹,

Hsu²,

Hu³

2012

Microelectronics Reliability

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“…At the same time, manufacturers should also understand recently-enacted environmental legislation and directives, and study their effects on the microelectronics industry (Ciocci and Pecht, 2006). Intensive research and developments of lead-free products (Arulvanan and Zhong, 2006) are stimulated by a USA Congress bill that has proposed to ban lead from a wide variety of uses (Kamal and Gouda, 2006). Developments of wearable microelectronics devices are also increasing (Whitmarsh, 2005).…”

Section: Introductionmentioning

confidence: 99%

Wire bonding using copper wire

Zhong

2009

Microelectronics International

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Purpose-This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach-Dozens of journal and conference articles published recently are reviewed. Findings-The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support structures are briefly analysed. The solutions to the problems and recent findings/developments in wire bonding using copper wire are discussed. Research limitations/implications-Because of page limitation of the paper, only a brief review is conducted. Further reading is needed for more details. Originality/value-This paper attempts to provide introduction to recent developments and the trends in wire bonding using copper wire. With the references provided, readers may explore more deeply by reading the original articles.

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Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder

Cited by 24 publications

References 23 publications

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes

Wire bonding using copper wire

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