Assembly and packaging technology on Silicon-Ceramic-based composite substrates

Kleinholz, C.; Fischer, M.; Müller, Jens

doi:10.23919/icep58572.2023.10129654

Cited by 4 publications

(2 citation statements)

References 2 publications

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“…The HTCC sacrificial tape prevents the lateral shrinkage of the outer surface of the LTCC during the sintering process and is used as release layer to avoid sticking to the pressure plates later on. The final SiCer composite substrate is created by sintering (10), either HPAS (pressure range: 200 -800 kPa, ATV PEO 603 sintering press) or with LPAS (pressure range: 1.8 -15 kPa, ATV PEO 603). The Si-side is facing upwards in the sintering furnace to prevent the flow of the softening ceramic into the Si-cavities during the sintering phase.…”

Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

“…During the optimization, special attention was paid to: generating a fully bonded interface, crack-free ceramic layers depending on various layout designs as well as compatibility with different metallization pastes for soldering and wire bond applications. The detailed optimization will be presented in a separate work (in progress [10]). The developed sintering profiles (increased and optimized profile) were also tested with the pressure sensor layout.…”

Section: A)mentioning

confidence: 99%

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Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Kleinholz,

Fischer,

Gutzeit

et al. 2024

IMAPSource Proceedings

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A variety of manufacturing methods can be used to assemble silicon-based piezoresistive pressure sensors, such as anodic bonding or silicon direct bonding. To achieve highstrength pressure sensors, a high quality interface connection is required. The combination of silicon and ceramic creates a new innovative composite system known as Silicon-on-Ceramics, short SiCer. By using a special developed bondable Low Temperature Co-fired Ceramic tape, which corresponds to the thermal expansion coefficient of Si, the combination of both materials is possible through a sintering process. Advantages of the SiCer technology are high temperature stability, manufacturing at wafer-level and a high bond strength at the interface. Different manufactured SiCer-based pressure sensors were fabricated, electrically and mechanically characterized and compared with anodic bonded and silicon direct bonded pressure sensors.

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Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

Section: A)mentioning

confidence: 99%