The resolution, line edge roughness, and sensitivity
(RLS) trade-off
has fundamentally limited the lithographic performance of chemically
amplified resists. Production of next-generation transistors using
extreme ultraviolet (EUV) lithography depends on a solution to this
problem. A resist that simultaneously increases the effective reaction
radius of its photogenerated acids while limiting their diffusion
radius should provide an elegant solution to the RLS barrier. Here,
we describe a generalized synthetic approach to phthalaldehyde derivatives
using sulfur(VI) fluoride exchange click chemistry that dramatically
expands usable chemical space by enabling virtually any non-ionic
photoacid generator (PAG) to be tethered to phthalaldehyde. The resulting
polymers represent the first ever PAG-tethered self-immolative resists
in an architecture that simultaneously displays high contrast, extraordinary
sensitivity, and low roughness under EUV exposure. We believe this
class of resists will ultimately enable researchers to overcome the
RLS trade-off.