Aromatic phosphorodiamidate curing agent for epoxy resin coating with flame-retarding properties

Jirasutsakul, Isara; Paosawatyanyong, Boonchoat; Bhanthumnavin, Worawan

doi:10.1016/j.porgcoat.2013.05.009

Cited by 30 publications

(18 citation statements)

References 18 publications

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“…Epoxy resins are today one of the most important group of polymeric materials [1][2][3][4][5][6][7][8].Among their advantages are the relatively high thermal stability and good whether resistance as well as resistance against many chemicals. Polar character of the resins determines their very good adhesion to materials such as metals, glass, concrete, and sufficiently polar polymers.…”

Section: Introductionmentioning

confidence: 99%

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

Murias

Byczyński

Maciejewski

et al. 2015

J Therm Anal Calorim

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The reactivity of a system comprising commercial epoxy resin Epidian Ò 6 (E6) and triethylenetetramine (Z-1) hardener was studied. The system was modified with two low-molecular siloxane modifiers: 1,3-bis(glycidyloxypropyl)-1,1,3,3-tetramethyldisiloxane (DS1) and 1,3-bis(aminopropyl)-1,1,3,3-tetramethyldisiloxane (DS2). The modifiers replaced 10 mass% of E6 or Z-1, respectively. The systems E6/DS2 and DS1/Z-1 were also studied. Enthalpy of curing was determined for all systems in isothermal conditions and dynamically, i.e., in the range of 0-250°C with linearly increasing temperature at the rate of 2, 5, 10, and 20°C min -1 . The activation energy of curing was determined using isoconversional methods by Friedman and Kissinger-Akahira-Sunose. The epoxy systems containing siloxane modifiers had generally lower activation energies than the reference E6/Z-1 system. The time to gelation measurements were taken using the temperaturemodulated differential scanning calorimetry.

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Section: Introductionmentioning

confidence: 99%

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

Murias

Byczyński

Maciejewski

et al. 2015

J Therm Anal Calorim

View full text Add to dashboard Cite

show abstract

“…A distinct absorption peak at 1241 cm -1 due to P=O stretching was found, which indicated the presence of the phosphonate. The characteristic peak at 1184 cm -1 was attributed to the P-O-C bonding while the asymmetrical stretching C-O bond appeared at 1049 cm -1 , and the absorption band at 1458 cm -1 was ascribed to the P-C bond [31]. , OH V and A V obtained from chemical titration; b) determined by GPC.…”

Section: Results and Discussion 31 Structure And Physical Propertimentioning

confidence: 99%

“…As the incorporation of HP-1001-COOH into the cured epoxy systems, which has higher molecular weight and lower T g (15°C), the bulky structure of HP-1001-COOH may cause longer intermolecular distance, and the entanglement of polymer chains is decreased. Therefore, the cured epoxy thermosets have higher segmental motion ability and lower T g [31]. a) T max is the temperature at the maximum rate degradation; b) DTG max is the maximum rate of degradation.…”

Section: Thermal Properties Of Cured Epoxy Resinsmentioning

confidence: 99%

Synthesis of a novel phosphorus-containing epoxy curing agent and the thermal, mechanical and flame-retardant properties of the cured products

Wang

Nie

2016

Polymer Degradation and Stability

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“…Epoxy resins are versatile thermosetting resins, and their applications include adhesives, high-performance composites, coatings, and electronics. [1][2][3][4] In general, epoxy resins, which are defined as prepolymers with two more epoxy groups, do not show excellent properties. Only by reacting with different kinds of curing agents are three-dimensional and highly crosslinked networks developed to provide superior mechanical properties and good thermal and dimensional stabilities.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of soybean oil–based curing agents for epoxy resin

Zhang

Yang

et al. 2017

J of Applied Polymer Sci

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In order to improve the flexibility properties of conventional epoxy resin, two novel soybean oil–based curing agents were synthesized. The curing agent obtained from the reaction between epoxy soybean oil and ethylene diamine was named EEDA, and another curing agent derived from epoxy soybean oil and isophorone diamine was named EIPDA. Several techniques were used to systematically investigate the effects of the structure and content of the two curing agents on the properties of the cured products. The Fourier transform infrared analysis demonstrated that epoxy resin reacted with soybean oil–based curing agents. The differential scanning calorimetry analysis showed that the curing process between diglycidyl ether of bisphenol‐A (DGEBA) and soybean oil–based curing agents only had an exothermic peak. Thermogravimetric analysis indicated that the cured DGEBA/EIPDA system was more stable than the DGEBA/EEDA system below 300 °C. Mechanical tests and Shore D hardness tests suggested that excessive EEDA greatly enhanced the toughness of cured products because of the introduction of aliphatic chains.© 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 134, 44754.

show abstract

Aromatic phosphorodiamidate curing agent for epoxy resin coating with flame-retarding properties

Cited by 30 publications

References 18 publications

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

A quantitative approach to dynamic and isothermal curing of an epoxy resin modified with oligomeric siloxanes

Synthesis of a novel phosphorus-containing epoxy curing agent and the thermal, mechanical and flame-retardant properties of the cured products

Preparation and properties of soybean oil–based curing agents for epoxy resin

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