2017
DOI: 10.1080/00207217.2017.1340978
|View full text |Cite
|
Sign up to set email alerts
|

Area efficient layout design of CMOS circuit for high-density ICs

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2018
2018
2022
2022

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 9 publications
(3 citation statements)
references
References 15 publications
0
3
0
Order By: Relevance
“…This results in switching ratio greater than 10 11 , which is much higher as discussed in literatures. 25,35,36 This leads to a motivation to further analyze the studied high-k dielectric-based nanoscaled MOSFET for the design of highly linear RF subsystems. Next, the analysis of linearity performance and intermodulation distortion itself explains that the device is suitable for high-frequency investigations.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…This results in switching ratio greater than 10 11 , which is much higher as discussed in literatures. 25,35,36 This leads to a motivation to further analyze the studied high-k dielectric-based nanoscaled MOSFET for the design of highly linear RF subsystems. Next, the analysis of linearity performance and intermodulation distortion itself explains that the device is suitable for high-frequency investigations.…”
Section: Discussionmentioning
confidence: 99%
“…This signifies that the immunity of device-D 2 over SCEs is excellent as compared to other available literatures. 12,15,25,35,36 This is due to the introduced DMIG technique in the design of FD SOI MOSFET. As, the DMIG technique will offer step-like potential profile which will further increase the average electric field under the first metal gate (M1).…”
Section: Model Calibration and Short-channel Electrical Characteristi...mentioning
confidence: 99%
“…It should be noted that complex gates have been proposed as a valuable alternative in terms of area and delay [4]. From a transistor-layer point of view, multiple design frameworks were proposed in order to achieve area efficient layouts of radiation hardened devices [5], or highly dense integrated circuits (ICs) [6].…”
Section: Related Workmentioning
confidence: 99%