2013
DOI: 10.1007/s11227-013-0940-9
|View full text |Cite
|
Sign up to set email alerts
|

Architecture and design of high-throughput, low-latency, and fault-tolerant routing algorithm for 3D-network-on-chip (3D-NoC)

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
31
0

Year Published

2015
2015
2022
2022

Publication Types

Select...
5
2
1

Relationship

0
8

Authors

Journals

citations
Cited by 45 publications
(31 citation statements)
references
References 27 publications
0
31
0
Order By: Relevance
“…The router is considered as the back-bone element in the whole ECN design. The ECN's router architecture is based upon OASIS NoC router (ONoC Router) [3], [9] with the addition of the optical switches arbitration module. Figure 1 illustrates ECN 's router architecture .…”
Section: A Electronic Control Network (Ecn)mentioning
confidence: 99%
“…The router is considered as the back-bone element in the whole ECN design. The ECN's router architecture is based upon OASIS NoC router (ONoC Router) [3], [9] with the addition of the optical switches arbitration module. Figure 1 illustrates ECN 's router architecture .…”
Section: A Electronic Control Network (Ecn)mentioning
confidence: 99%
“…There are many different forms of NoC architecture out in development [6], [4], [14], [15], [16]. Most of these do not address fault issues within switches.…”
Section: Related Workmentioning
confidence: 99%
“…Others do not even address the issue of the throughput limitation of electrical signals. 3D-OASIS [15] and the original mesh [14] architecture both resort to using electrical interconnects, which have been proven to have lower throughput than their optical alternative. Additionally, optical data requires less power per bit [5].This new technology is not 100% beneficial, as can be seen with the results of certain optical NoCs.…”
Section: Related Workmentioning
confidence: 99%
See 1 more Smart Citation
“…Global interconnects are becoming the principal performance bottleneck for high performance Systems-on-Chip (SoCs) [2]. The 3-dimensional Networks-on-Chip (3D-NoCs) have been proposed as a promising architecture that combines the high parallelism of Network-on-Chip paradigm with the high performance and lower interconnect power of 3-dimensional integration circuits (3D-ICs) [6]. In the past few years, the benefits of 3D Integrated Circuits (3D-ICs) and mesh-based Network-on-Chips (NoCs) have been fused into a promising architecture opening a new horizon for IC design.…”
Section: Introductionmentioning
confidence: 99%