Applying Substance-Field Model for Packaging Quality Improvement

Abstract

This paper aims to provide a thorough analysis on the application of TRIZ in improving the quality of medical product assembly and packaging. TRIZ tools such as engineering system analysis, function analysis, cause and effect chain analysis, substance-field model and 76 Standard Inventive Solutions are applied in order to discover some feasible and elegant solutions to alleviate the problem without making the machine more complex. Findings revealed that the problem of defective packaging is caused by the dust/air particles. Failure for a visioning system to detect the rejected printing on the package and inconsistent sealing integrity is caused by uneven surface of the package. The root causes are solved by applying substance-field model, System of Standard Inventive algorithm and 76 Standard Inventive Solutions. Therefore, it can be concluded that substance-field model of TRIZ is a powerful tool in inventive problem solving.