Applying strain gauges to measuring thermal warpage of printed circuit boards

Huang, Chien‐Yi; Ying, Kuo‐Ching

doi:10.1016/j.measurement.2017.06.029

Cited by 10 publications

(6 citation statements)

References 19 publications

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“…In measuring the CTE of materials, many researchers have successfully established numerous approaches such as dilatometr y, optical heterodyne interferometry, digital image correlation (DIC) and strain gage measurement (Lanaz di Scalea 1998, Ratanawilai et al 2003, Kubler et al 2007, Cordero et al 2009, Kulesh et al 2009, Crawford et al 2010, De Strycker et al 2010, Wang & Tong 2013, Tang et al 2014, Hou et al 2016, Huang & Ying 2017). The dilatometry system generally consists of a tube thermal drive such as a furnace to heat the specimen and a push-rod connecting to the sensor to detect the displacement of the specimen.…”

Section: Introductionmentioning

confidence: 99%

Coefficient of Thermal Expansion of Rubberwood (Hevea Brasiliensis) in Convective Drying Process

Kaung¹,

Thanate²

2020

JTFS

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Rubberwood drying is an energy-intensive process where drying defects are the main problems faced by the wood industry. The main objective of this study is to evaluate the coefficient of thermal expansion (CTE) of rubberwood to have a better understanding of the effect of temperature over the distortions of rubberwood during drying. Rubberwood samples were first dried at three different hot air temperatures and the mechanical properties of dried rubberwood samples were tested in the preliminary experiment to determine the suitable temperature condition for further evaluation of the CTEs of rubberwood samples. The CTEs of rubberwood in tangential and radial directions were evaluated through strain gages at three different moisture content (MC) levels: above 60%, at 12% and almost 0% (dry state). Based on the findings of this work, the CTEs of rubberwood in the tangential direction were found to have higher values than that of radial direction. The rubberwood samples had the highest CTEs values at 12% MC in both directions. Also, no significant differences were found between the experimental and expected CTE values of rubberwood as a function of specific gravity in the dry state.

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Section: Introductionmentioning

confidence: 99%

Coefficient of Thermal Expansion of Rubberwood (Hevea Brasiliensis) in Convective Drying Process

Kaung¹,

Thanate²

2020

JTFS

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“…Thus, this promotes expansion differences between the two components. Previous studies have reported that a greater differences in CTE values resulted in a sizeable deformation [12]. As the different components found in the quarter model remain bonded together throughout the process, deformation occurs due to the different contraction where the PCB and substrate pull the silicon die.…”

Section: Resultsmentioning

confidence: 96%

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

et al. 2022

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Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and NSMD-NSMD is conducted through ABAQUS software and is applied with Anand model equation. The applied loading onto the test assembly is set with reflow cooling temperature of 220 °C to 25 °C. The purpose of this research is to obtain the package warpage, stress, and inelastic equivalent strain throughout the package and solder joints and to develop a predictive finite element model for mechanics and deformation of solder joint in BGA package under reflow cooling. The results obtained showed that solder joints with NSMD-NSMD pad geometry has a greater inelastic equivalent strain and has a greater potential in failing than SMD-NSMD pad geometry. Therefore, it can be concluded that SMD-NSMD pad geometry is more preferable for obtaining a more reliable solder joint.

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“…The prototype was validated by measuring transition temperatures for four different commercially available polymers. These values were compared with data obtained by TMA and DSC techniques [10] .…”

Section: Introductionmentioning

confidence: 99%

Low-cost and novel Arduino®-Load cell-based prototype to determine transition temperatures

Rodríguez-Pacheco,

Paraguay-Delgado,

Castañeda-Balderas

et al. 2024

Polímeros

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The polymer transition temperature is a crucial parameter in the industry for knowing raw materials before starting the manufacturing process. The current work reports a novel low-cost prototype instrument to measure the transition temperature with reliable accuracy. The equipment was built using commercial load cells composed of strain gauges in combination with an Arduino® microcontroller. The prototype measurement quality was validated by measuring the transition temperatures of most commercial polymers. The obtained values were compared with values obtained by conventional thermal analysis known as differential scanning calorimetric and thermo-mechanical analysis (DSC and TMA), which results in identical values.

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Applying strain gauges to measuring thermal warpage of printed circuit boards

Cited by 10 publications

References 19 publications

Coefficient of Thermal Expansion of Rubberwood (Hevea Brasiliensis) in Convective Drying Process

Coefficient of Thermal Expansion of Rubberwood (Hevea Brasiliensis) in Convective Drying Process

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

Low-cost and novel Arduino®-Load cell-based prototype to determine transition temperatures

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