2017
DOI: 10.1016/j.ndteint.2017.07.014
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Applied multiresolution analysis to infrared images for defects detection in materials

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Cited by 21 publications
(9 citation statements)
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“…In civil engineering, thermography is used for the non-destructive diagnostics of building structures, most often for validation of quality and integrity of building envelopes [ 20 ], in energy audits of buildings [ 21 ] and diagnostics of building materials, including wood [ 13 , 22 , 23 , 24 , 25 , 26 ]. It should be noted that active thermography is successfully used in the diagnosis of isotropic materials.…”
Section: Introductionmentioning
confidence: 99%
“…In civil engineering, thermography is used for the non-destructive diagnostics of building structures, most often for validation of quality and integrity of building envelopes [ 20 ], in energy audits of buildings [ 21 ] and diagnostics of building materials, including wood [ 13 , 22 , 23 , 24 , 25 , 26 ]. It should be noted that active thermography is successfully used in the diagnosis of isotropic materials.…”
Section: Introductionmentioning
confidence: 99%
“…Generally, conventional industrial quality monitoring involves the design of a reasonable imaging plan based on the characteristics and properties of surface defects and then uses area clipping, edge detection and other methods to isolate the main body of the defect. Finally, after extracting specific features (such as histogram of oriented gradients; (HOG); and local binary patterns (LBP)), it inputs them into the classifier or uses the threshold method to obtain the defect type [2][3][4][5][6][7][8][9][10]. For example, Xie et al found that ordinary optical inspection technology could not accurately identify semiconductor defects with large changes in scale, displacement and rotation and proposed using real noise data and simulated data to train a support vector machine (SVM) to achieve defect classification.…”
Section: Introductionmentioning
confidence: 99%
“…It was concluded that in order to obtain a more accurate dimensions of the defect, it was necessary to analyze the infrared thermal image with the largest temperature difference contrast or immediately thereafter by analyzing the defect results at different distances and inspection times. Kabouri A. et al [6] selected the frames that depicted the largest average surface temperature of the specimen as the candidate image frame data. However, the robustness of the image frame sequence selection methodology has been shown to be generally poor, and the proposed method of selecting an infrared sequence key frame has poor accuracy in the final defect extraction.…”
Section: Introductionmentioning
confidence: 99%
“…In the second approach of defects analysis which focuses more on digital processing of infrared images, a sparse principal component thermography (SPCT) method had been proposed to enhance the contrast of the defect induced thermal anomaly with respect to the background and the noise of the imaging sensor [27]. At present, the most mainstream method of defect representation (area) is still using the equivalent pixel ratio method [5,6], which estimates the defect area through the number of image pixels of the defect image. The equivalent length ratio for each pixel can be calibrated by using the known dimension of the specimen.…”
Section: Introductionmentioning
confidence: 99%