Applications of SPM in the metal plating industry

Nichols, Richard J.; Schröer, D.; Meyer, H.

doi:10.1002/sca.4950150505

Cited by 19 publications

(4 citation statements)

References 2 publications

(3 reference statements)

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“…Studies of copper OPD onto Au(111) have focused on determining deposit morphology, characterizing kinetics of the electronucleation process, and examining how different molecular additives influence the course of the deposition process. ,− The most recent papers are related to the SPM techniques, which have become a favorite tool for metal deposition investigation.…”

Section: Introductionmentioning

confidence: 99%

New Insights into Evaluation of Kinetic Parameters for Potentiostatic Metal Deposition with Underpotential and Overpotential Deposition Processes

2000

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Kinetics of copper deposition onto an Au(111) surface from sulfuric acid electrolyte, was evaluated using potentiostatic current transients. Measurements were conducted employing a new and nontraditional method, with gold electrode completely free from copper deposit at the beginning of the potential step (i.e., deposition process). The current transients obtained clearly show partial contribution from copper underpotential deposition (UPD) and copper overpotential deposition (OPD) processes. Quantitative evaluation of experimental transients was performed with the recently developed method for theoretical transient computer simulation. Detailed analysis of the kinetic parameters shows that copper UPD could be characterized as a two-dimensional nucleation and growth limited by the lattice incorporation (2D-LI) process and copper OPD as a three-dimensional nucleation process limited by diffusion-controlled growth (3D-DC). The UPD seems to be an inevitable part of the deposition process and takes place prior to OPD, regardless of the potential applied. Therefore, UPD should be treated as an early stage of the deposition process. Furthermore, our results show that the kinetics differs depending on whether deposition is initiated from a clean, bare Au(111) surface or from a gold surface already coated with a copper UPD adlayer. This indicates the role of the UPD process and the UPD adlayer on the course of OPD. Differences observed in deposition kinetics between electrolytic baths at pH 2 and 4 were likely due to adsorption of different sulfate species (sulfate or bisulfate anions) on the copper-deposit-modified Au(111) substrate (UPD, epitaxial monolayer) or bulk deposit adlayer (OPD).

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Section: Introductionmentioning

confidence: 99%

New Insights into Evaluation of Kinetic Parameters for Potentiostatic Metal Deposition with Underpotential and Overpotential Deposition Processes

2000

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“…It is often necessary to add brightener besides leveling additive. According to Nichols et al [ 18,19] it is most likely that adsorbed active additive blocks growth in the vertical direction. By adsorption of additives on flat surface, additive directs deposition of metal on the steps of growth, which leads to the formation of atomic smooth layered coating.…”

Section: Phenomenon Of Leveling Of Metal Coatingsmentioning

confidence: 99%

Morphology and structure of bright electrodeposited metal coatings

Pavlović

2011

Maced. J. Chem. Chem. Eng.

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The properties which determine whether the metal surface is mirror bright are precisely determined by scanning electron microscopy (SEM), atomic forces microscopy (AFM), scanning tunneling microscopy (STM) and reflectance spectrophotometry investigations. Mirror brightness of metal surfaces can be associated with the high degree of mirror reflection which approaches very nearly the ideal reflectance of the same metal with the lowest degree of diffuse reflection. Mirror brightness of the copper coatings and the copper surfaces polished both mechanically and electrochemically was determined by flat and mutually parallel parts of the surface, which are smooth on the atomic level and which point out towards layer structure of these surfaces. Mirror bright metal surfaces can be obtained only by electrochemical polishing or electrochemical deposition in the presence of brightening addition agents.

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“…They can also use the same term when referring to different concepts. For example, SPM and FSL both use a global scaling of the data to get ‘percent BOLD signal change’, but due to differences in how the brain mask and mean signal are computed, the data are scaled quite differently 23 and are not comparable. In order to fully describe an analysis, the sharing of software-specific batch scripts (e.g., SPM matlabbatch files, FSL fsf files, or history stored in AFNI brick headers) would be a simple solution to provide all the parameters from an analysis, but the ability to compare and query across software would still be lacking.…”

Section: Introductionmentioning

confidence: 99%

Sharing brain mapping statistical results with the neuroimaging data model

et al. 2016

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Only a tiny fraction of the data and metadata produced by an fMRI study is finally conveyed to the community. This lack of transparency not only hinders the reproducibility of neuroimaging results but also impairs future meta-analyses. In this work we introduce NIDM-Results, a format specification providing a machine-readable description of neuroimaging statistical results along with key image data summarising the experiment. NIDM-Results provides a unified representation of mass univariate analyses including a level of detail consistent with available best practices. This standardized representation allows authors to relay methods and results in a platform-independent regularized format that is not tied to a particular neuroimaging software package. Tools are available to export NIDM-Result graphs and associated files from the widely used SPM and FSL software packages, and the NeuroVault repository can import NIDM-Results archives. The specification is publically available at: http://nidm.nidash.org/specs/nidm-results.html.

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Applications of SPM in the metal plating industry

Cited by 19 publications

References 2 publications

New Insights into Evaluation of Kinetic Parameters for Potentiostatic Metal Deposition with Underpotential and Overpotential Deposition Processes

New Insights into Evaluation of Kinetic Parameters for Potentiostatic Metal Deposition with Underpotential and Overpotential Deposition Processes

Morphology and structure of bright electrodeposited metal coatings

Sharing brain mapping statistical results with the neuroimaging data model

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