2012
DOI: 10.1149/1.3694404
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Applications Driving Adoption of Direct Bond Technology

Abstract: The high bond energy at low temperature capability of direct bond technology results in bonded structures and 3D ICs with the lowest distortion, highest density of 3D interconnects and thinnest form factor. These attributes and compatibility with industry standard manufacturing have led to the adoption of this technology in the supply chain for volume manufacturing of backside illuminated (BSI) image sensors. The establishment of this technology in the supply chain will reduce the adoption barrier for other … Show more

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