Application of UV depth lithography and 3D-microforming for high aspect ratio electromagnetic microactuator components

Abstract

This paper was presented at the Fourth International Workshop on High Aspect Ratio Micro-Structure Technology (HARMST) 2001 in Baden-Baden, Germany.For building high aspect ratio parts, using a combination of UV lithography and electroplating is a very promising approach. This paper describes investigations regarding the application of UV lithography and electroplating to fabricate high aspect ratio component parts of microactuators, such as coils and pole pieces. As resist materials, both novolac-based resists and photosensitive epoxy were investigated. The high aspect ratio photomasks were used as micromolds for electroplating coils and magnetic structures in micromotors.

Evaluation of Heat Transfer on Micro‐Structured Surfaces Based on Entropy Production

“…The structures were manufactured by electropolating following a photoresist process [18]. The investigated test plates differ in their surface coverage H. The surface coverage is the fraction of the referenced smooth surface, which is covered by cubes (Eq.…”

Microelectromechanical Systems

“…Plating rate can be increased by using FIGURE 28.4 Typical high-aspect-ratio structure obtained with epoxy resin. (Reproduced from [8] with permission from Springer Science þ Business Media.) high metal ion concentrations and/or by decreasing the diffusion boundary layer thickness through forced electrolyte convection.…”

High aspect ratio spiral and vertical meander micro coils for actuator applications

“…UV-depth lithography with DNQ/Novolak resist (AZ 9260, Clariant) and photo sensitive epoxy (SU-8, MCC) was applied for high aspect ratio micromolds [17,18]. The SU-8 resist was left in place and served as an organic, encapsulating dielectric film with excellent planarization capabilities [19].…”