Application of TOFSIMS for Contamination Issues in the Assembly World

Pathangey, B.; Proctor, Andrew; Zhi-yong, Wang; Fu, Zezhong; Tanikella, R.

doi:10.1109/tdmr.2007.900057

Cited by 8 publications

(2 citation statements)

References 5 publications

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“…A drift failure is both progressive and partial [1] [8]- [10].…”

Section: Defect Failurementioning

confidence: 99%

Reliability and Failures of Electronic Components /Systems

Băjenescu¹

2021

EEA

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The typical bathtub curve and its “standard” shape have been widely accepted as an engineering tool in reliability management and training. The paper is not only focused on the performance at different periods but trying to reveal some in-depth considerations regarding service life and reliability, defect and failure, failure categories and classifications, failure mechanisms, factors favouring electronic systems failures, the process problems, or the passivation layer.

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“…A drift failure is both progressive and partial [1] [8]- [10].…”

Section: Defect Failurementioning

confidence: 99%

Reliability and Failures of Electronic Components /Systems

Băjenescu¹

2021

EEA

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“…[5] Pathangey et al reported the TOF-SIMS applications in interface delamination, metal migration, microcracking issues for flip-chip, wire-bond, and novel mixed technology packages. [6] In addition, Cheung reported package delamination caused by PDMS using TOF-SIMS. [7] XPS has good elemental quantitative capability.…”

Section: Introductionmentioning

confidence: 99%

Applications of XPS and TOF-SIMS in the investigation of PCB package delamination

Yang

Yiqiang

Sheng

et al. 2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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In this study, die to printed circuit board (PCB) interfacial failure was investigated. Instead of using conventional Scanning Electron Microscope -Energy Dispersive X-ray Spectroscopy (SEM-EDX) and Fourier Transform Infrared Spectroscopy (FTIR) for bulk material analysis, advanced surface analysis techniques such as X-ray Photoelectron Spectroscopy (XPS) and Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) were employed to analyze the delamination between die and PCB. High percentage of siloxane bond was revealed at the failure interface using XPS. TOF-SIMS was used to further validate that the siloxane bond belongs to Polydimethylsiloxane (PDMS) from blue tape. Combining both XPS and TOF-SIMS analysis techniques, it was shown that the die to PCB delamination was attributed to PDMS contamination.

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Failure Analysis – When?

Bazu

Băjenescu

2011

Failure Analysis

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Application of TOFSIMS for Contamination Issues in the Assembly World

Cited by 8 publications

References 5 publications

Reliability and Failures of Electronic Components /Systems

Reliability and Failures of Electronic Components /Systems

Applications of XPS and TOF-SIMS in the investigation of PCB package delamination

Failure Analysis – When?

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