IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society 2016
DOI: 10.1109/iecon.2016.7793471
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Application of the unified electric motor Bond Graph model to HB-type and PM-type Vernier machines

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Cited by 6 publications
(2 citation statements)
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“…MOSFETs' short-circuit failures have been the subject of much more study than open-circuit faults and mature fault-tolerant solutions. Open MOSFETs seem to be the most prevalent cause of MOSFET wire bond module failures, according to many studies [25][26][27][28][29]. Short-circuit failures in semiconductor power devices, on the other hand, are more common than open-circuit faults, according to [29].…”
Section: Mosfet Short-circuit Defectivenessmentioning
confidence: 99%
“…MOSFETs' short-circuit failures have been the subject of much more study than open-circuit faults and mature fault-tolerant solutions. Open MOSFETs seem to be the most prevalent cause of MOSFET wire bond module failures, according to many studies [25][26][27][28][29]. Short-circuit failures in semiconductor power devices, on the other hand, are more common than open-circuit faults, according to [29].…”
Section: Mosfet Short-circuit Defectivenessmentioning
confidence: 99%
“…In [32], a unified bond graph model has been developed for hybrid‐excited and PMVMs. A generic power flow‐based electric machine model has been highlighted for its fitness for an unconventional machine such as PMVM.…”
Section: Torque Productionmentioning
confidence: 99%