Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging

Inoue, Fumihiro; Phommahaxay, Alain; Gokita, Yohei; Möller, Berthold; Beyne, Eric

doi:10.1007/s00170-021-08622-x

Cited by 4 publications

(1 citation statement)

References 32 publications

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“…Wafer-level packaging (WLP) has been developed rapidly in recent years, mainly applied in small-sized, high-yielding and highly consistent packaging (Inoue et al , 2022; Esashi, 2008; Theuss et al , 2020). The photo etching and resin-based material application in WLP makes this method highly accurate and low-cost, showing potential in fabricating micro-coaxial transition.…”

Section: Introductionmentioning

confidence: 99%

A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications

Zhao,

Pang,

Wang

et al. 2023

SSMT

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Purpose This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss. Design/methodology/approach An advanced packaging method, 12-inch wafer-level through-mold-via (TMV) additive manufacturing, is used to fabricate a 3D resin-based coaxial transition with a continuous ground wall (named resin-coaxial transition). Designation and simulation are implemented to ensure the application universality and fabrication feasibility. The outer radius R of coaxial transition is optimized by designing and fabricating three samples. Findings The fabricated coaxial transition possesses an inner radius of 40 µm and a length of 200 µm. The optimized sample with an outer radius R of 155 µm exhibits S11 < –10 dB and S21 > –1.3 dB at 10–110 GHz and the smallest insertion loss (S21 = 0.83 dB at 77 GHz) among the samples. Moreover, the S21 of the samples increases at 58.4–90.1 GHz, indicating a broad and suitable working bandwidth. Originality/value The wafer-level TMV additive manufacturing method is applied to fabricate coaxial transitions for the first time. The fabricated resin-coaxial transitions show good performance up to the W-band. It may provide new strategies for novel designing and fabricating methods of RF transitions.

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Section: Introductionmentioning

confidence: 99%