2000 TENCON Proceedings. Intelligent Systems and Technologies for the New Millennium (Cat. No.00CH37119)
DOI: 10.1109/tencon.2000.888765
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Application of signal analysis techniques for condition monitoring of a wire bonding machine

P.A. Ahmad
1
,
Ahmad Zuri Sha’ameri2,
Sheikh Hussain Shaikh Salleh
3
et al.
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