2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00265
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Application of package-level high-performance EMI shield material with a novel nozzleless spray coating technology

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Cited by 3 publications
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“…suppression can be achieved by sputtering and electroplating a thin metal layer of less than 10 µm on a single package unit with radiation exceeding the standard. However, on the one hand, the cost of this method is very high, on the other hand, electromagnetic waves reflected inside the package will cause electromagnetic immunity problems and affect the quality of signal transmission [3]. However, another solution can effectively absorb the incident electromagnetic wave, and there will be neither transmission nor reflection in the working frequency band, and it is easier to ameliorate SI [4]- [7].…”
Section: Introductionmentioning
confidence: 99%
“…suppression can be achieved by sputtering and electroplating a thin metal layer of less than 10 µm on a single package unit with radiation exceeding the standard. However, on the one hand, the cost of this method is very high, on the other hand, electromagnetic waves reflected inside the package will cause electromagnetic immunity problems and affect the quality of signal transmission [3]. However, another solution can effectively absorb the incident electromagnetic wave, and there will be neither transmission nor reflection in the working frequency band, and it is easier to ameliorate SI [4]- [7].…”
Section: Introductionmentioning
confidence: 99%