Abstract:During an electrical testing stage, each die on a wafer must be tested to determine whether it functions as it was originally designed. In the case of a clustered defect on the wafer, such as scratches, stains, or localized failed pattems, the tester may not detect all of the defective dies in the flawed area. To avoid the defective dies proceeding to final assembly, an existing tool is currently used by a testing faclory to detect the defect cluster and mark all the defective dies in the flawed region or clos… Show more
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