Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading

Rajaguru, Pushparajah; Lu, Hua; Bailey, C.

doi:10.1016/j.ijfatigue.2012.06.013

Cited by 15 publications

(8 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…21, it may suggest that at long life the elastic strain amplitude is dominant, whereas at shorter life the incremental equivalent plastic strain is dominant. This statement and figure have been documented in many classic mechanics text book [7], [19] and researches [4], [10]. The point at which the elastic and plastic domains overlap is called the transition life.…”

Section: A Life Prediction Model Establishingmentioning

confidence: 84%

“…Ramminger et al [15] utilized the plastic strain calculated by coarse model and enlarged sub-models, together with the Coffin-Manson relation, to predict the thermal fatigue life of wire. Rajaguru et al [4] discussed the wire lift-off failure mechanism and its fatigue life by a FE model, reduced-order model, Coffin-Manson relation, and linear cumulative damage theory. This study intended to focus on the reliability assessment of the bonding wire by employing the power cycling test.…”

Section: Fatigue Model Of Bonding Wirementioning

confidence: 99%

See 1 more Smart Citation

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

Hung

Liao

Wang

et al. 2014

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

In this paper, a 3-D finite-element (FE) model was established based on real test samples. Coupled electrothermal and thermal-mechanical FE analyses were conducted to analyze the mechanical behavior of bonding wire under cyclic power loading. The current crowding phenomenon may be improved by increasing the wire number. The junction temperature can be decreased by decreasing the joule heat from the current crowding around the bonding wire. The findings suggest that the power module with wire configuration design shall be operated in a higher power load; meanwhile, the identical reliability can be guaranteed. The temperature predicted by the simulation was consistent with the experimental data. Incremental equivalent plastic strain was not observed when the current loading was low. However, the plastic ratio progressively enhanced with the current load. With a high current load, the yielding effect should be considered. Plastic strain dominated the failure mechanism. The concepts of high-and low-cycle fatigue should be incorporated into the life prediction model for modules subjected to low and high current loadings, respectively. After the simulation results were validated with the experimental data, two models for the design of power modules were proposed.

show abstract

Section: A Life Prediction Model Establishingmentioning

confidence: 84%

Section: Fatigue Model Of Bonding Wirementioning

confidence: 99%

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

Hung

Liao

Wang

et al. 2014

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

show abstract

“…For irregular cyclic loading conditions, a widely used technique for predicting lifetime is to use a cycle counting algorithm to sort irregular loading profiles into cycles with different loading amplitude and then use a fatigue lifetime model for regular cyclic loading and the Miners' linear damage accumulation rule to predict the damage accumulation in the solder layer. This includes the Rainflow cycle counting method [6] for cycle counting, and then the Coffin Mason or other nonlinear fatigue models [7] can then be used for calculating lifetime under fixed amplitude cyclic loading conditions. An application of this methodology for SnAg solder joint crack development and propagation process was demonstrated by Kostandyan et al [8] for PEM devices.…”

Section: Overview Of Existing Damage Modelsmentioning

confidence: 99%

Time Integration Damage Model for Sn3.5Ag Solder Interconnect in Power Electronic Module

Rajaguru

Bailey

2019

IEEE Trans. Device Mater. Relib.

Self Cite

View full text Add to dashboard Cite

In this study, existing damage evolution models in the literature for solder layer in microelectronics have been reviewed. A two dimensional approximate semi-analytic time integration damage indicator model for Sn3.5Ag material solder interconnect in power electronic module has been proposed. The proposed time dependent damage model is dependent on the inelastic strain, the accumulated damage at previous time step and the temperature. The strains were approximated semi-analytically. A numerical modelling methodology combined with the data from public domain for crack initiation and crack propagation of Sn3.5Ag solder layer has been adopted to extract the parameter values of the proposed damage model. The proposed model has advantages over fatigue lifetime models as it instantaneously predicts the damage over time for any loading history. The damage model was compared with Ansys FEA tool based damage prediction using Coffin Manson and Paris law fatigue models. The predicted damage value by the model is slightly higher than those models. Furthermore, this damage model does not need a time consuming numerical simulation evaluating the damage model variables, which is an advantage

show abstract

“…Naturally one of the question arises, do these observations (Figure 9(b)) depend on the surrogate model chosen? Hence we utilised another surrogate model namely Kriging model [30] in order to observe similar trend. Sensitivity plot of Kriging model for the data in Table 4 as in Figure 10 (a).…”

Section: Sensitivity Analysismentioning

confidence: 99%

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

Rajaguru

Bailey

et al. 2017

Microelectronics Reliability

View full text Add to dashboard Cite

This paper primarily focuses on an evaluation study for the temperature cycling capability of tin silver solder interconnect in power electronic applications by the impact of die dimensions and die material properties. The study was investigated on finite element analysis perspective on chip/solder/substrate structure. A commercially available chip was chosen in the finite element analysis (FEA) as the nominal base die. Two thermal cycle profiles were utilised. The effect of die area, die thickness and material properties (Si and SiC) on the thermal cycling capability of the solder layer was investigated from FEA perspective. From the FEA, it was concluded that decrease in die thickness resulting in increment of thermal cycling capability of solder layer for both material (Si and SiC). Increase in die area increases the thermal cycling capability of solder. For higher ΔT thermal cycle, solder under SiC die perform better than solder under Si die in terms of thermal cycling capability. When the die thickness become smaller than a threshold value of the thermal cycle regime, solder under Si die have better thermal cycling capability than solder under SiC die. Additionally a parametric study was undertaken for a SiC chip/substrate structure under high ∆T temperature cycling profile for solder layer geometric parameter (wetting angle, titling angle and thickness). From the parametric study which utilised design of experiments (DoE), a wavelet radial basis surrogate model was generated. A sensitivity analysis was performed on surrogate model in order to identify the most influencing parameter. From the sensitivity analysis, it was concluded that wetting angle and solder layer thickness of solder layer have significant impact on the thermal cycling capability of the solder layer.

show abstract

Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading

Cited by 15 publications

References 25 publications

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

Time Integration Damage Model for Sn3.5Ag Solder Interconnect in Power Electronic Module

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

Contact Info

Product

Resources

About