Abstract:Epoxy resins are widely utilized as high performance thermosetting adhesives. Polyamide cured epoxies provide improved flexibility, moisture resistance, and adhesion. Moreover, Versamid could provide lower viscosity, better compatibility, and better cure profiles under adverse conditions. Thus, the use of polyamide (Versamid 125) as a curing agent and HTPB as an elastomeric rubbery modifier give this study an importance in formulating adhesives to be used in high temperature applications. A systematic study ha… Show more
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